View PIC24HJ256GP610_1127790.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

dsPIC33F/PIC24H
dsPIC33F/PIC24H Flash Programming Specification
1.0 DEVICE OVERVIEW
* * * * * * * * * * * * * PIC24HJ128GP306 PIC24HJ128GP310 PIC24HJ128GP506 PIC24HJ128GP510 PIC24HJ256GP206 PIC24HJ256GP210 PIC24HJ256GP610 dsPIC33FJ12GP201 dsPIC33FJ12GP202 dsPIC33FJ12MC201 dsPIC33FJ12MC202 PIC24HJ12GP201 PIC24HJ12GP202 This document defines the programming specification for the dsPIC33F 16-bit Digital Signal Controller (DSC) and PIC24H 16-bit Microcontroller (MCU) families. This programming specification is required only for those developing programming support for the dsPIC33F/ PIC24H family. Customers only using one of these devices should use development tools that already provide support for device programming. This document includes programming specifications for the following devices: * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * dsPIC33FJ64GP206 dsPIC33FJ64GP306 dsPIC33FJ64GP310 dsPIC33FJ64GP706 dsPIC33FJ64GP708 dsPIC33FJ64GP710 dsPIC33FJ128GP206 dsPIC33FJ128GP306 dsPIC33FJ128GP310 dsPIC33FJ128GP706 dsPIC33FJ128GP708 dsPIC33FJ128GP710 dsPIC33FJ256GP506 dsPIC33FJ256GP510 dsPIC33FJ256GP710 dsPIC33FJ64MC506 dsPIC33FJ64MC508 dsPIC33FJ64MC510 dsPIC33FJ64MC706 dsPIC33FJ64MC710 dsPIC33FJ128MC506 dsPIC33FJ128MC510 dsPIC33FJ128MC706 dsPIC33FJ128MC708 dsPIC33FJ128MC710 dsPIC33FJ256MC510 dsPIC33FJ256MC710 PIC24HJ64GP206 PIC24HJ64GP210 PIC24HJ64GP506 PIC24HJ64GP510 PIC24HJ128GP206 PIC24HJ128GP210
2.0
PROGRAMMING OVERVIEW OF THE dsPIC33F/PIC24H
There are two methods of programming the dsPIC33F/ PIC24H family of devices discussed in this programming specification. They are: * In-Circuit Serial ProgrammingTM (ICSPTM) programming capability * Enhanced In-Circuit Serial Programming The ICSP programming method is the most direct method to program the device; however, it is also the slower of the two methods. It provides native, low-level programming capability to erase, program and verify the chip. The Enhanced ICSP protocol uses a faster method that takes advantage of the programming executive, as illustrated in Figure 2-1. The programming executive provides all the necessary functionality to erase, program and verify the chip through a small command set. The command set allows the programmer to program the dsPIC33F/PIC24H Programming Specification devices without having to deal with the low-level programming protocols of the chip.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 1
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
FIGURE 2-1: PROGRAMMING SYSTEM OVERVIEW FOR ENHANCED ICSPTM
dsPIC33F/PIC24H Programmer Programming Executive
FIGURE 2-2:
CONNECTIONS FOR THE ON-CHIP REGULATOR
3.3V dsPIC33F/PIC24H VDD VDDCORE
CF On-Chip Memory VSS
Note 1:
This specification is divided into major sections that describe the programming methods independently. Section 3.0 "Device Programming - Enhanced ICSP" describes the Enhanced ICSP method. Section 5.0 "Device Programming - ICSP" describes the ICSP method.
These are typical operating voltages. Refer to Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements" for the full operating ranges of VDD and
2.2
2.1
Power Requirements
Program Memory Write/Erase Requirements
All devices in the dsPIC33F/PIC24H family are dual voltage supply designs: one supply for the core and another for the peripherals and I/O pins. A regulator is provided on-chip to alleviate the need for two external voltage supplies. All of the dsPIC33F/PIC24H devices power their core digital logic at a nominal 2.5V. To simplify system design, all devices in the dsPIC33F/PIC24H Programming Specification family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator provides power to the core from the other VDD pins. A low-ESR capacitor (such as tantalum) must be connected to the VDDCORE pin (Figure 2-2). This helps to maintain the stability of the regulator. The specifications for core voltage and capacitance are listed in Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements".
The program Flash memory on the dsPIC33F/PIC24H has a specific write/erase requirement that must be adhered to for proper device operation. The rule is that any given word in memory must not be written without first erasing the page in which it is located. Thus, the easiest way to conform to this rule is to write all the data in a programming block within one write cycle. The programming methods specified in this document comply with this requirement.
Note:
A program memory word can be programmed twice before an erase, but only if (a) the same data is used in both program operations or (b) bits containing `1' are set to `0' but no `0' is set to `1'.
DS70152D-page 2
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
2.3 Pin Diagrams
The pin diagrams for the dsPIC33F/PIC24H device family are shown in the following figures. The pins that are required for programming are listed in Table 2-1. The MCLR, PGC1, PGD1, PGC2, PGD2, PGC3 and PGD3 pins are shown in bold letters in the figures. Refer to the appropriate device data sheet for complete pin descriptions.
TABLE 2-1:
Pin Name
PIN DESCRIPTIONS (PINS USED DURING PROGRAMMING)
During Programming Pin Name Pin Type P P P P I I/O I I/O I I/O Programming Enable Power Supply Ground Regulated Power Supply for Core Primary Programming Pin Pair: Serial Clock Primary Programming Pin Pair: Serial Data Secondary Programming Pin Pair: Serial Clock Secondary Programming Pin Pair: Serial Data Tertiary Programming Pin Pair: Serial Clock Tertiary Programming Pin Pair: Serial Data Pin Description
MCLR VDD and AVDD(1) VSS and AVSS(1) VDDCORE PGC1 PGD1 PGC2 PGD2 PGC3 PGD3
MCLR VDD VSS VDDCORE PGC1 PGD1 PGC2 PGD2 PGC3 PGD3
Legend: I = Input, O = Output, P = Power Note 1: All power supply and ground pins must be connected, including analog supplies (AVDD) and ground (AVSS).
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 3
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams
64-Pin TQFP
CSDO/RG13 CSDI/RG12 CSCK/RG14 RG0 RG1 RF1 RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
COFS/RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
dsPIC33FJ64GP206 dsPIC33FJ128GP206
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/CN17/RF4 U2TX/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
DS70152D-page 4
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
CSDO/RG13 CSDI/RG12 CSCK/RG14 RG0 RG1 RF1 RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
COFS/RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
dsPIC33FJ64GP306 dsPIC33FJ128GP306
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/SDA2/CN17/RF4 U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Preliminary
DS70152D-page 5
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
CSDO/RG13 CSDI/RG12 CSCK/RG14 RG0 RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
COFS/RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
dsPIC33FJ256GP506
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/SDA2/CN17/RF4 U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
DS70152D-page 6
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
CSDO/RG13 CSDI/RG12 CSCK/RG14 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
COFS/RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
dsPIC33FJ64GP706 dsPIC33FJ128GP706
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/SDA2/CN17/RF4 U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Preliminary
DS70152D-page 7
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
80-Pin TQFP
CSCK/RG14 AN23/CN23/RA7 AN22/CN22/RA6 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13
CSDO/RG13 CSDI/RG12
C2RX/RG0 C2TX/RG1
80 79 78 77 76
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1
COFS/RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/AN20/INT1/RA12 TDO/AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
60 59 58 57 56 55 54 53 52
PGC2/EMUC2/SOSCO/T1CK/ CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 SDA2/INT4/RA3 SCL2/INT3/RA2 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ64GP708 dsPIC33FJ128GP708
51 50 49 48 47 46 45 44 43 42 41 40 U2TX/CN18/RF5
PGD1/EMUD1/AN7/RB7
AN15/OCFB/CN12/RB15 IC7/U1CTS/CN20/RD14
AN10/RB10
TCK/AN12/RB12
AN9/RB9
AN11/RB11
U2CTS/AN8/RB8
PGC1/EMUC1/AN6/OCFA/RB6
DS70152D-page 8
Preliminary
IC8/U1RTS/CN21/RD15
U2RTS/AN14/RB14
U2RX/CN17/RF4
TDI/AN13/RB13
VREF+/RA10
VREF-/RA9
AVDD
AVSS
VDD
VSS
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
AN28/RE4 AN27/RE3 AN26/RE2 CSDO/RG13 CSDI/RG12 CSCK/RG14 AN25/RE1 AN24/RE0 AN23/CN23/RA7 AN22/CN22/RA6 RG0 RG1 RF1 RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
COFS/RG15 VDD AN29/RE5 AN30/RE6 AN31/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/INT1/RA12 AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ64GP310 dsPIC33FJ128GP310
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Preliminary
DS70152D-page 9
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
AN28/RE4 AN27/RE3 AN26/RE2 CSDO/RG13 CSDI/RG12 CSCK/RG14 AN25/RE1 AN24/RE0 AN23/CN23/RA7 AN22/CN22/RA6 RG0 RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
COFS/RG15 VDD AN29/RE5 AN30/RE6 AN31/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/INT1/RA12 AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ256GP510
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DS70152D-page 10
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
AN28/RE4 AN27/RE3 AN26/RE2 CSDO/RG13 CSDI/RG12 CSCK/RG14 AN25/RE1 AN24/RE0 AN23/CN23/RA7 AN22/CN22/RA6 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
COFS/RG15 VDD AN29/RE5 AN30/RE6 AN31/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/INT1/RA12 AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ64GP710 dsPIC33FJ128GP710 dsPIC33FJ256GP710
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Preliminary
DS70152D-page 11
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
PWM3L/RE4 PWM2H/RE3 PWM2L/RE2 PWM1H/RE1 PWM1L/RE0 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/UPDN/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/QEB/IC8/CN7/RB5 AN4/QEA/IC7/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
dsPIC33FJ64MC506
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/FLTB/INT2/RD9 IC1/FLTA/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/CN17/RF4 U2TX/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
DS70152D-page 12
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
PWM3L/RE4 PWM2H/RE3 PWM2L/RE2 PWM1H/RE1 PWM1L/RE0 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/UPDN/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/QEB/IC8/CN7/RB5 AN4/QEA/IC7/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
dsPIC33FJ128MC506 dsPIC33FJ64MC506 dsPIC33FJ128MC706
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/FLTB/INT2/RD9 IC1/FLTA/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/SDA2/CN17/RF4 U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Preliminary
DS70152D-page 13
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
80-Pin TQFP
CRX2/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/UPDN/RD7
PWM3L/RE4 PWM2H/RE3
PWM2L/RE2 PWM1H/RE1
PWM1L/RE0
OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1
PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/FLTA/INT1/RE8 TDO/FLTB/INT2/RE9 AN5/QEB/CN7/RB5 AN4/QEA/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 23 24 25 26 27 28 29 30 31 32 33 21 22 34 35 36 37 38 39 40
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA3 INT3/RA2 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ64MC508
PGC1/EMUC1/AN6/OCFA/RB6
AN11/RB11
U2CTS/AN8/RB8
PGD1/EMUD1/AN7/RB7
AN15/OCFB/CN12/RB15 IC7/U1CTS/CN20/RD14
DS70152D-page 14
Preliminary
IC8/U1RTS/CN21/RD15
U2RTS/AN14/RB14
U2RX/CN17/RF4
TCK/AN12/RB12
U2TX/CN18/RF5
VREF+/RA10
AN9/RB9
AN10/RB10
VREF-/RA9
TDI/AN13/RB13
AVDD
AVSS
VDD
VSS
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
80-Pin TQFP
CRX2/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/UPDN/RD7 OC7/CN15/RD6
PWM2H/RE3
PWM3L/RE4
PWM2L/RE2 PWM1H/RE1 PWM1L/RE0
OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1
PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/FLTA/INT1/RE8 TDO/FLTB/INT2/RE9 AN5/QEB/CN7/RB5 AN4/QEA/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 SDA2/INT4/RA3 SCL2/INT3/RA2 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ128MC708
PGD1/EMUD1/AN7/RB7
AN15/OCFB/CN12/RB15 IC7/U1CTS/CN20/RD14
TCK/AN12/RB12
PGC1/EMUC1/AN6/OCFA/RB6
U2CTS/AN8/RB8
U2RTS/AN14/RB14
(c) 2007 Microchip Technology Inc.
Preliminary
IC8/U1RTS/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
AN10/RB10
AN9/RB9
AN11/RB11
TDI/AN13/RB13
VREF+/RA10
VREF-/RA9
AVDD
AVSS
VDD
VSS
DS70152D-page 15
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
PWM3L/RE4 PWM2H/RE3 PWM2L/RE2 CSDO/RG13 CSDI/RG12 CSCK/RG14 PWM1H/RE1 PWM1L/RE0 AN23/CN23/RA7 AN22/CN22/RA6 RG0 RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/UPDN//CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
COFS/RG15 VDD PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/FLTA/INT1/RE8 AN21/FLTB/INT2/RE9 AN5/QEB/CN7/RB5 AN4/QEA/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 RA3 RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ64MC510
65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DS70152D-page 16
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
PWM3L/RE4 PWM2H/RE3 PWM2L/RE2 CSDO/RG13 CSDI/RG12 CSCK/RG14 PWM1H/RE1 PWM1L/RE0 AN23/CN23/RA7 AN22/CN22/RA6 RG0 RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/UPDN//CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
COFS/RG15 VDD PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/FLTA/INT1/RE8 AN21/FLTB/INT2/RE9 AN5/QEB/CN7/RB5 AN4/QEA/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ128MC510 dsPIC33FJ256MC510
65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Preliminary
DS70152D-page 17
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
PWM3L/RE4 PWM2H/RE3 PWM2L/RE2 CSDO/RG13 CSDI/RG12 CSCK/RG14 PWM1H/RE1 PWM1L/RE0 AN23/CN23/RA7 AN22/CN22/RA6 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/UPDN//CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
COFS/RG15 VDD PWM3H/RE5 PWM4L/RE6 PWM4H/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/FLTA/INT1/RE8 AN21/FLTB/INT2/RE9 AN5/QEB/CN7/RB5 AN4/QEA/CN6/RB4 AN3/INDX/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
dsPIC33FJ64MC710 dsPIC33FJ128MC710 dsPIC33FJ256MC710
65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DS70152D-page 18
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
RG13 RG12 RG14 RG0 RG1 RF1 RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PIC24HJ64GP206 PIC24HJ128GP206 PIC24HJ256GP206
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
Note:
The PIC24HJ64GP206 device does not have the SCL2 and SDA2 pins.
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/CN17/RF4 U2TX/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Preliminary
DS70152D-page 19
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
RG13 RG12 RG14 RG0 RG1 RF1 RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PIC24HJ128GP306
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/SDA2/CN17/RF4 U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
DS70152D-page 20
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
64-Pin TQFP
CSDO/RG13 CSDI/RG12 CSCK/RG14 RG0 RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 OC2/RD1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
COFS/RG15 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/T5CK/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/CN4/RB2 PGC3/EMUC3/AN1/VREF-/CN3/RB1 PGD3/EMUD3/AN0/VREF+/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PIC24HJ64GP506 PIC24HJ128GP506
PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/T4CK/CN1/RC13 OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/U1CTS/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD SCL1/RG2 SDA1/RG3 U1RTS/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 TMS/AN10/RB10 TDO/AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/SDA2/CN17/RF4 U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Preliminary
DS70152D-page 21
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
AN28/RE4 AN27/RE3 AN26/RE2 RG13 RG12 RG14 AN25/RE1 AN24/RE0 AN23/CN23/RA7 AN22/CN22/RA6 RG0 RG1 RF1 RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1
RG15 VDD AN29/RE5 AN30/RE6 AN31/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/INT1/RA12 AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
PIC24HJ64GP210 PIC24HJ128GP210 PIC24HJ128GP310 PIC24HJ256GP210
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DS70152D-page 22
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64
AN28/RE4 AN27/RE3 AN26/RE2 RG13 RG12 RG14 AN25/RE1 AN24/RE0 AN23/CN23/RA7 AN22/CN22/RA6 RG0 RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1
RG15 VDD AN29/RE5 AN30/RE6 AN31/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/INT1/RA12 AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
PIC24HJ64GP510 PIC24HJ128GP510
63 62 61 60 59 58 57 56 55 54 53 52 51
(c) 2007 Microchip Technology Inc.
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Preliminary
DS70152D-page 23
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
100-Pin TQFP
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66
AN28/RE4 AN27/RE3 AN26/RE2 RG13 RG12 RG14 AN25/RE1 AN24/RE0 AN23/CN23/RA7 AN22/CN22/RA6 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VDDCORE OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1
RG15 VDD AN29/RE5 AN30/RE6 AN31/RE7 AN16/T2CK/T7CK/RC1 AN17/T3CK/T6CK/RC2 AN18/T4CK/T9CK/RC3 AN19/T5CK/T8CK/RC4 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD TMS/RA0 AN20/INT1/RA12 AN21/INT2/RA13 AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 AN2/SS1/CN4/RB2 PGC3/EMUC3/AN1/CN3/RB1 PGD3/EMUD3/AN0/CN2/RB0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
VSS PGC2/EMUC2/SOSCO/T1CK/CN0/RC14 PGD2/EMUD2/SOSCI/CN1/RC13 OC1/RD0 IC4/RD11 IC3/RD10 IC2/RD9 IC1/RD8 INT4/RA15 INT3/RA14 VSS OSC2/CLKO/RC15 OSC1/CLKIN/RC12 VDD TDO/RA5 TDI/RA4 SDA2/RA3 SCL2/RA2 SCL1/RG2 SDA1/RG3 SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8 U1RX/RF2 U1TX/RF3
PIC24HJ256GP610
65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
PGC1/EMUC1/AN6/OCFA/RB6 PGD1/EMUD1/AN7/RB7 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/RA1 U2RTS/RF13 U2CTS/RF12 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 VSS VDD IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DS70152D-page 24
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
18-PIN SDIP 18-PIN SOIC
MCLR PGD2/EMUD2/AN0/VREF+/CN2/RA0 PGC2/EMUC2/AN1/VREF-/CN3/RA1 PGD1/EMUD1/AN2/RP0/CN4/RB0 PGC1/EMUC1/AN3/RP1/CN5/RB1 OSCI/CLKI/CN30/RA2 OSCO/CLKO/CN29/RA3 PGD3/EMUD3/SOSCI/RP4/CN1/RB4 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
1 2 3 4 5 6 7 8 9
18 17
VDD VSS
AN6/RP15/CN11/RB15 AN7/RP14/CN12/RB14
(c) 2007 Microchip Technology Inc.
Preliminary
dsPIC33FJ12GP201 PIC24HJ12GP201
16 15 14 13 12 11 10
VDDCORE VSS
SCL1/RP9/CN21/RB9 SDA1/RP8/CN22/RB8 INT0/RP7/CN23/RB7
DS70152D-page 25
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
20-PIN SDIP 20-PIN SSOP
MCLR PGD2/EMUD2/AN0/VREF+/CN2/RA0 PGC2/EMC2/AN1/VREF-/CN3/RA1 PGD1/EMUD1/AN2/RP0/CN4/RB0 PGC1/EMUC1/AN3/RP1/CN5/RB1
1 2
20 19
VDD
3 4 5 6 7 8 9 10
18 17 16 15 14 13 12 11
VSS
OSCI/CLKI/CN30/RA2 OSCO/CLKO/CN29/RA3 PGD3/EMUD3/SOSCI/RP4/CN1/RB4 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
Pin Diagrams (Continued)
28-PIN SDIP 28-PIN SOIC
PGD2/EMUD2/AN0/VREF+/CN2/RA0 PGC2/EMUC2/AN1/VREF-/CN3/RA1 PGD1/EMUD1/AN2/RP0/CN4/RB0 PGC1/EMUC1/AN3/RP1/CN5/RB1
AN4/RP2/CN6/RB2 AN5/RP3/CN7/RB3
3 4
26 25
AN6/RP15/CN11/RB15 AN7/RP14/CN12/RB14 AN8/RP13/CN13/RB13 AN9/RP12/CN14/RB12 TMS/RP11/CN15/RB11 TDI/RP10/CN16/RB10
5 6 7 8 9 10 11 12 13 14
24 23 22 21 20 19 18 17 16 15
PGD3/EMUD3/SOSC/RP4/CN1/RB4 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
TDO/SDA1/RP9/CN21/RB9 TCK/SCL1/RP8/CN22/RB8 INT0/RP7/CN23/RB7 ASCL1/RP6/CN24/RB6
ASDA1/RP5/CN27/RB5
DS70152D-page 26
Preliminary
ssV
OSCI/CLKI/CN29/RA3
EROCDDV
OSCO/CLK1/CN30/RA2
ss VA
2
27
DD VA
MCLR
1
28
s sV
PWM1L1/RP15/CN11/RB15 PWM1H1/RP14/CN12/RB14 PWM1L2/RP13/CN13/RB13 PWM1H2/RP12/CN14/RB12
dsPIC33FJ12MC201
dsPIC33FJ12GP202 PIC24HJ12GP202
VDDCORE
PWM2L1/SDA1/RP9/CN21/RB9 PWM2H1/SCL1/RP8/CN22/RB8 INT0/RP7/CN23/RB7
ssV
DDV
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
28-PIN SDIP 28-PIN SOIC
MCLR PGD2/EMUD2/AN0/VREF+/CN2/RA0 PGC2/EMUC2/AN1/VREF-/CN3/RA1 PGD1/EMUD1/AN2/RP0/CN4/RB0 PGC1/EMUC1/AN3/RP1/CN5/RB1 AN4/RP2/CN6/RB2 AN5/RP3/CN7/RB3
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
AVDD AVss
PWM1L1/RP15/CN11/RB15 PWM1H1/RP14/CN12/RB14 PWM1L2/RP13/CN13/RB13 PWM1H2/RP12/CN14/RB12 TMS/PWM1L3/RP11/CN15/RB11 TDI/PWM1H3/RP10/CN16/RB10
DDCORE
dsPIC33FJ12MC202
OSCO/CLKO/CN29/RA3 PGD3/EMUD3/SOSCI/RP4/CN1/RB4 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
TDO/PWM2L1/SDA1/RP9/CN21/RB9 TCK/PWM2H1/SCL1/RP8/CN22/RB8 INT0/RP7/CN23/RB7 ASCL1/RP6/CN24/RB6
VDD
ASDA1/RP5/CN27/RB5
(c) 2007 Microchip Technology Inc.
Preliminary
V
OSCI/CLKI/CN30/RA2
ssV
Vss
DS70152D-page 27
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
28-Pin QFN 6*6mm
PGD2/EMUD2/AN0/VREF+/CN2/RA0 PGC2/EMUC2/AN1/VREF-/CN3/RA1
AN6/RP15/CN11/RB15 23
28 PGD1/EMUD1/AN2/RP0/CN4/RB0 PGC1/EMUC1/AN3/RP1/CN5/RB1 AN4/RP2/CN6/RB2 AN5/RP3/CN7/RB3 1 2 3 4 5 6 7 8 PGD3/EMUD3/SOSCI/RP4/CN1/RB4
27
26
25
24
22 21 20 19 AN8/RP13/CN13/RB13 AN9/RP12/CN14/RB12 TMS/RP11/CN15/RB11 TDI/RP10/CN16/RB10
dsPIC33FJ12GP202 PIC24HJ12GP202
AN7/RP14/CN12/RB14 18 17 16 15
MCLR
VSS
OSCI/CLKI/CN30/RA2 OSCO/CLKO/CN29/RA3
AVDD
AVSS
VDDCORE
V SS
TDO/SDA1/RP9/CN21/RB9
9 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
10
11 ASDA1/RP5/CN27/RB5
12 ASCL1/RP6/CN24/RB6
13 INT0/RP7/CN23/RB7
14 TCK/SCL1/RP8/CN22/RB8
DS70152D-page 28
Preliminary
V DD
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Pin Diagrams (Continued)
28-Pin QFN 6*6mm
PGD2/EMUD2/AN0/VREF+/CN2/RA0
PGC2/EMUC2/AN1/VREF-/CN3/RA1
28 PGD1/EMUD1/AN2/RP0/CN4/RB0 PGC1/EMUC1/AN3/RP1/CN5/RB1 AN4/RP2/CN6/RB2 AN5/RP3/CN7/RB3
1 2 3 4 5 6 7 8
27
26
25
24
23
PWM1H1/ RP14/CN12/RB14
PWM1L1/RP15/CN11/RB15
MCLR
AVDD
AV ss
22
21 20 19
PWM1L2/RP13/CN13/RB13 PWM1H2/RP12/CN14/RB12 TMS/PWM1L3/RP11/CN15/RB11 TDI/PWM1H3/RP10/CN16/RB10
dsPIC33FJ12MC202
18 17 16 15
VSS
OSCI/CLKI/CN30/RA2 OSCO/CLKO/CN29/RA3
VDDCORE
VSS
TDO/PWM2L1/SDA1/RP9/CN21/RB9
9
10
11
12
13
14
PGD3/EMUD3/SOSCI/RP4/CN1/RB4
PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
ASDA1/RP5/CN27/RB5
ASCL1/RP6/CN24/RB6
INT0/RP7/CN23/RB7
VDD
(c) 2007 Microchip Technology Inc.
Preliminary
TCK/PWM2H1/SCL1/RP8/CN22/RB8
DS70152D-page 29
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
2.4 Memory Map
gramming and the debug executive is used for in-circuit debugging. This region of memory can not be used to store user code. Locations 0xF80000 through 0xF80017 are reserved for the device Configuration registers. Locations 0xFF0000 and 0xFF0002 are reserved for the Device ID Word registers. These bits can be used by the programmer to identify what device type is being programmed. They are described in Section 7.0 "Device ID". The Device ID registers read out normally, even after code protection is applied. Figure 2-3 shows the memory map for the dsPIC33F/ PIC24H family variants.
The program memory map extends from 0x0 to 0xFFFFFE. Code storage is located at the base of the memory map and supports up to 88K instructions (about 256 Kbytes). Table 2-2 shows the program memory size and number of erase and program blocks present in each device variant. Each erase block, or page, contains 512 instructions and each program block, or row, contains 64 instructions. Locations 0x800000 through 0x800FFE are reserved for executive code memory. This region stores the programming executive and the debugging executive. The programming executive is used for device pro-
TABLE 2-2:
CODE MEMORY SIZE
User Memory Address Limit (Instruction Words) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x02ABFE (88K) 0x02ABFE (88K) 0x02ABFE (88K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x02ABFE (88K) 0x02ABFE (88K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x00ABFE (22K) 0x0157FE (44K) 0x0157FE (44K) Write Blocks 344 344 344 344 344 344 688 688 688 688 688 688 1368 1368 1368 344 344 344 344 344 688 688 688 688 688 1368 1368 344 344 344 344 688 688 Erase Blocks 43 43 43 43 43 43 86 86 86 86 86 86 171 171 171 43 43 43 43 43 86 86 86 86 86 171 171 43 43 43 43 86 86 Executive Memory Address Limit (Instruction Words) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K)
dsPIC33F/PIC24H Device dsPIC33FJ64GP206 dsPIC33FJ64GP306 dsPIC33FJ64GP310 dsPIC33FJ64GP706 dsPIC33FJ64GP708 dsPIC33FJ64GP710 dsPIC33FJ128GP206 dsPIC33FJ128GP306 dsPIC33FJ128GP310 dsPIC33FJ128GP706 dsPIC33FJ128GP708 dsPIC33FJ128GP710 dsPIC33FJ256GP506 dsPIC33FJ256GP510 dsPIC33FJ256GP710 dsPIC33FJ64MC506 dsPIC33FJ64MC508 dsPIC33FJ64MC510 dsPIC33FJ64MC706 dsPIC33FJ64MC710 dsPIC33FJ128MC506 dsPIC33FJ128MC510 dsPIC33FJ128MC706 dsPIC33FJ128MC708 dsPIC33FJ128MC710 dsPIC33FJ256MC510 dsPIC33FJ256MC710 PIC24HJ64GP206 PIC24HJ64GP210 PIC24HJ64GP506 PIC24HJ64GP510 PIC24HJ128GP206 PIC24HJ128GP210
DS70152D-page 30
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 2-2:
PIC24HJ128GP306 PIC24HJ128GP310 PIC24HJ128GP506 PIC24HJ128GP510 PIC24HJ256GP206 PIC24HJ256GP210 PIC24HJ256GP610 dsPIC33FJ12GP201 dsPIC33FJ12GP202 dsPIC33FJ12MC201 dsPIC33FJ12MC202 PIC24HJ12GP201 PIC24HJ12GP202
CODE MEMORY SIZE (CONTINUED)
0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x0157FE (44K) 0x02ABFE (88K) 0x02ABFE (88K) 0x02ABFE (88K) 0x001FFE (4K) 0x001FFE (4K) 0x001FFE (4K) 0x001FFE (4K) 0x001FFE (4K) 0x001FFE (4K) 688 688 688 688 1368 1368 1368 64 64 64 64 64 64 86 86 86 86 171 171 171 8 8 8 8 8 8 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x800FFE (2K) 0x8007FE (1K) 0x8007FE (1K) 0x8007FE (1K) 0x8007FE (1K) 0x8007FE (1K) 0x8007FE (1K)
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 31
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
FIGURE 2-3: PROGRAM MEMORY MAP
0x000000
User Flash Code Memory (87552 x 24-bit)
0x02ABFE 0x02AC00 User Memory Space
Reserved
0x7FFFFE 0x800000 Executive Code Memory (2048 x 24-bit) 0x800FFE 0x801000
Reserved Configuration Memory Space
Configuration Registers (12 x 8-bit)
0xF7FFFE 0xF80000 0xF80017 0xF80018
Reserved 0xFEFFFE 0xFF0000 0xFF0002 0xFF0004 0xFFFFFE
Device ID (2 x 16-bit) Reserved
Note:
The address boundaries for user Flash and Executive code memory are device dependent.
DS70152D-page 32
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
3.0 DEVICE PROGRAMMING - ENHANCED ICSP
3.1 Overview of the Programming Process
This section discusses programming the device through Enhanced ICSP and the programming executive. The programming executive resides in executive memory (separate from code memory) and is executed when Enhanced ICSP Programming mode is entered. The programming executive provides the mechanism for the programmer (host device) to program and verify the dsPIC33F/PIC24H Programming Specification family devices using a simple command set and communication protocol. There are several basic functions provided by the programming executive: * * * * * Read Memory Erase Memory Program Memory Blank Check Read Executive Firmware Revision
Figure 3-1 shows the high-level overview of the programming process. After entering Enhanced ICSP mode, the programming executive is verified. Next, the device is erased. Then, the code memory is programmed, followed by the nonvolatile device Configuration registers. Code memory (including the Configuration registers) is then verified to ensure that programming was successful. After the programming executive has been verified in memory (or loaded if not present), the dsPIC33F/ PIC24H Programming Specification can be programmed using the command set shown in Table 3-1.
FIGURE 3-1:
HIGH-LEVEL ENHANCED ICSPTM PROGRAMMING FLOW
Start
The programming executive performs the low-level tasks required for erasing, programming and verifying a device. This allows the programmer to program the device by issuing the appropriate commands and data. Table 3-1 summarizes the commands. A detailed description for each command is provided in Section 4.2 "Programming Executive Commands".
Enter Enhanced ICSPTM
Perform Bulk Erase
TABLE 3-1:
Command SCHECK READC READP PROGC PROGP PROGW QBLANK QVER
COMMAND SET SUMMARY
Description Sanity check Read Configuration registers or Device ID registers Read code memory Program a Configuration register and verify Program one row of code memory and verify Program one word of code memory and verify Query if the code memory is blank Query the software version
Done Exit Enhanced ICSP Program Configuration Bits Verify Program Program Memory
Verify Configuration Bits
The programming executive uses the device's data RAM for variable storage and program execution. After the programming executive has run, no assumptions should be made about the contents of data RAM.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 33
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
3.2 Confirming the Presence of the Programming Executive 3.3 Entering Enhanced ICSP Mode
Before programming can begin, the programmer must confirm that the programming executive is stored in executive memory. The procedure for this task is shown in Figure 3-2. First, ICSP mode is entered. Then, the unique Application ID Word stored in executive memory is read. If the programming executive is resident, the Application ID Word is 0xBB, which means programming can resume as normal. However, if the Application ID Word is not 0xBB, the programming executive must be programmed to executive code memory using the method described in Section 6.0 "Programming the Programming Executive to Memory". Section 5.0 "Device Programming - ICSP" describes the ICSP programming method. Section 5.11 "Reading the Application ID Word" describes the procedure for reading the Application ID Word in ICSP mode.
As shown in Figure 3-3, entering Enhanced ICSP Program/Verify mode requires three steps: 1. 2. 3. The MCLR pin is briefly driven high then low. A 32-bit key sequence is clocked into PGD. MCLR is then driven high within a specified period of time and held.
The programming voltage applied to MCLR is VIH, which is essentially VDD in the case of dsPIC33F/ PIC24H devices. There is no minimum time requirement for holding at VIH. After VIH is removed, an interval of at least P18 must elapse before presenting the key sequence on PGD. The key sequence is a specific 32-bit pattern, `0100 1101 0100 0011 0100 1000 0101 0000' (more easily remembered as 0x4D434850 in hexadecimal format). The device will enter Program/Verify mode only if the key sequence is valid. The Most Significant bit (MSb) of the most significant nibble must be shifted in first. Once the key sequence is complete, VIH must be applied to MCLR and held at that level for as long as Program/Verify mode is to be maintained. An interval time of at least P19 and P7 must elapse before presenting data on PGD. Signals appearing on PGD before P7 has elapsed will not be interpreted as valid. On successful entry, the program memory can be accessed and programmed in serial fashion. While in the Program/Verify mode, all unused I/Os are placed in the high-impedance state.
FIGURE 3-2:
CONFIRMING PRESENCE OF PROGRAMMING EXECUTIVE
Start
Enter ICSPTM Mode
Read the Application ID from Address 0x807F0
Is Application ID 0xBB? Yes Prog. Executive is Resident in Memory
No
Prog. Executive must be Programmed
Finish
DS70152D-page 34
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
FIGURE 3-3: ENTERING ENHANCED ICSPTM MODE
P6 P14 MCLR VIH VIH P19 P7
VDD PGD PGC P18 0 b31
Program/Verify Entry Code = 0x4D434850 1 b30 0 b29 0 b28 1 b27 ... 0 b3 0 b2 0 b1 0 b0
P1A P1B
3.4
Blank Check
3.5
3.5.1
Code Memory Programming
PROGRAMMING METHODOLOGY
The term "Blank Check" implies verifying that the device has been successfully erased and has no programmed memory locations. A blank or erased memory location is always read as a `1'. The Device ID registers (0xFF0000:0xFF0002) can be ignored by the Blank Check since this region stores device information that cannot be erased. The device Configuration registers are also ignored by the Blank Check. Additionally, all unimplemented memory space should be ignored from the Blank Check. The QBLANK command is used for the Blank Check. It determines if the code memory is erased by testing these memory regions. A `BLANK' or `NOT BLANK' response is returned. If it is determined that the device is not blank, it must be erased before attempting to program the chip.
Code memory is programmed with the PROGP command. PROGP programs one row of code memory starting from the memory address specified in the command. The number of PROGP commands required to program a device depends on the number of write blocks that must be programmed in the device. A flowchart for programming code memory is shown in Figure 3-4. In this example, all 88K instruction words of a dsPIC33F/PIC24H device are programmed. First, the number of commands to send (called `RemainingCmds' in the flowchart) is set to 1368 and the destination address (called `BaseAddress') is set to `0'. Next, one write block in the device is programmed with a PROGP command. Each PROGP command contains data for one row of code memory of the dsPIC33F/PIC24H. After the first command is processed successfully, `RemainingCmds' is decremented by `1' and compared with `0'. Since there are more PROGP commands to send, `BaseAddress' is incremented by 0x80 to point to the next row of memory. On the second PROGP command, the second row is programmed. This process is repeated until the entire device is programmed.. Note: If a bootloader needs to be programmed, the bootloader code must not be programmed into the first page of code memory. For example, if a bootloader located at address 0x200 attempts to erase the first page, it would inadvertently erase itself. Instead, program the bootloader into the second page, e.g. 0x400.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 35
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
FIGURE 3-4: FLOWCHART FOR PROGRAMMING CODE MEMORY
Start
3.5.2
PROGRAMMING VERIFICATION
After code memory is programmed, the contents of memory can be verified to ensure that programming was successful. Verification requires code memory to be read back and compared against the copy held in the programmer's buffer. The READP command can be used to read back all the programmed code memory. Alternatively, you can have the programmer perform the verification after the entire device is programmed, using a checksum computation.
BaseAddress = 0x0 RemainingCmds = 1368
Send PROGP Command to Program BaseAddress
3.5.3
CHECKSUM COMPUTATION
Is PROGP response PASS? Yes RemainingCmds = RemainingCmds - 1 BaseAddress = BaseAddress + 0x80 No Is RemainingCmds `0'? Yes Finish
No
Only the Configuration registers are included in the checksum computation. The Device ID and Unit ID are not included in the checksum computation. Table 3-2 shows how this 16-bit computation can be made for each dsPIC33F and PIC24H device. Computations for read code protection are shown both enabled and disabled. The checksum values shown here assume that the Configuration registers are also erased. However, when code protection is enabled, the value of the FGS register is assumed to be 0x5.
Failure Report Error
DS70152D-page 36
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-2:
Device
CHECKSUM COMPUTATION
Read Code Protection Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Checksum Computation Erased Value 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA Value with 0xAAAAAA at 0x0 and Last Code Address 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA
dsPIC33FJ64GP206 dsPIC33FJ64GP306 dsPIC33FJ64GP310 dsPIC33FJ64GP706 dsPIC33FJ64GP708 dsPIC33FJ64GP710
CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:02ABFF) CFGB
dsPIC33FJ128GP206 Disabled Enabled dsPIC33FJ128GP306 Disabled Enabled dsPIC33FJ128GP310 Disabled Enabled dsPIC33FJ128GP706 Disabled Enabled dsPIC33FJ128GP708 Disabled Enabled dsPIC33FJ128GP710 Disabled Enabled dsPIC33FJ256GP506 Disabled Enabled dsPIC33FJ256GP510 Disabled Enabled dsPIC33FJ256GP710 Disabled Enabled Item Description:
SUM(a:b) = Byte sum of locations a to b inclusive (all 3 bytes of code memory) CFGB = Configuration Block (masked) = Byte sum of ((FBS & 0xCF) + (FSS & 0xFF) + (FGS & 0x07) + (FOSCSEL & 0xA7) + (FOSC & 0xE7) + (FWDT & 0xDF) + (FPOR & 0xE7) + (FICD & 0xE3)) (for dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202) = Byte sum of ((FBS & 0xCF) + (FSS & 0xCF) + (FGS & 0x07) + (FOSCSEL & 0xA7) + (FOSC & 0xC7) + (FWDT & 0xDF) + (FPOR & 0xE7) + (FICD & 0xE3)) (for all other devices)
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 37
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-2:
Device
CHECKSUM COMPUTATION (CONTINUED)
Read Code Protection Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Checksum Computation Erased Value 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA Value with 0xAAAAAA at 0x0 and Last Code Address 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA
dsPIC33FJ64MC506 dsPIC33FJ64MC508 dsPIC33FJ64MC510 dsPIC33FJ64MC706 dsPIC33FJ64MC710
CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:00ABFF) CFGB
dsPIC33FJ128MC506 Disabled Enabled dsPIC33FJ128MC510 Disabled Enabled dsPIC33FJ128MC706 Disabled Enabled dsPIC33FJ128MC708 Disabled Enabled dsPIC33FJ128MC710 Disabled Enabled dsPIC33FJ256MC510 Disabled Enabled dsPIC33FJ256MC710 Disabled Enabled PIC24HJ64GP206 PIC24HJ64GP210 PIC24HJ64GP506 Item Description: Disabled Enabled Disabled Enabled Disabled Enabled
SUM(a:b) = Byte sum of locations a to b inclusive (all 3 bytes of code memory) CFGB = Configuration Block (masked) = Byte sum of ((FBS & 0xCF) + (FSS & 0xFF) + (FGS & 0x07) + (FOSCSEL & 0xA7) + (FOSC & 0xE7) + (FWDT & 0xDF) + (FPOR & 0xE7) + (FICD & 0xE3)) (for dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202) = Byte sum of ((FBS & 0xCF) + (FSS & 0xCF) + (FGS & 0x07) + (FOSCSEL & 0xA7) + (FOSC & 0xC7) + (FWDT & 0xDF) + (FPOR & 0xE7) + (FICD & 0xE3)) (for all other devices)
DS70152D-page 38
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-2:
Device
CHECKSUM COMPUTATION (CONTINUED)
Read Code Protection Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Disabled Enabled Checksum Computation Erased Value 0x03BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x01BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0x03BC 0x05BA 0xD60C 0x060A 0xD60C 0x060A 0xD60C 0x060A 0xD60C 0x060A 0xD60C 0x060A 0xD60C 0x060A Value with 0xAAAAAA at 0x0 and Last Code Address 0x01BE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0xFFBE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0x01BE 0x05BA 0xD40E 0x060A 0xD40E 0x060A 0xD40E 0x060A 0xD40E 0x060A 0xD40E 0x060A 0xD40E 0x060A
PIC24HJ64GP510 PIC24HJ128GP206 PIC24HJ128GP210 PIC24HJ128GP306 PIC24HJ128GP310 PIC24HJ128GP506 PIC24HJ128GP510 PIC24HJ256GP206 PIC24HJ256GP210 PIC24HJ256GP610 dsPIC33FJ12GP201 dsPIC33FJ12GP202 dsPIC33FJ12MC201 dsPIC33FJ12MC202 PIC24HJ12GP201 PIC24HJ12GP202 Item Description:
CFGB + SUM(0:00ABFF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:0157FF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:02ABFF) CFGB CFGB + SUM(0:001FFF) CFGB CFGB + SUM(0:001FFF) CFGB CFGB + SUM(0:001FFF) CFGB CFGB + SUM(0:001FFF) CFGB CFGB + SUM(0:001FFF) CFGB CFGB + SUM(0:001FFF) CFGB
SUM(a:b) = Byte sum of locations a to b inclusive (all 3 bytes of code memory) CFGB = Configuration Block (masked) = Byte sum of ((FBS & 0xCF) + (FSS & 0xFF) + (FGS & 0x07) + (FOSCSEL & 0xA7) + (FOSC & 0xE7) + (FWDT & 0xDF) + (FPOR & 0xE7) + (FICD & 0xE3)) (for dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202) = Byte sum of ((FBS & 0xCF) + (FSS & 0xCF) + (FGS & 0x07) + (FOSCSEL & 0xA7) + (FOSC & 0xC7) + (FWDT & 0xDF) + (FPOR & 0xE7) + (FICD & 0xE3)) (for all other devices)
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 39
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
3.6
3.6.1
Configuration Bits Programming
OVERVIEW
The dsPIC33F/PIC24H has Configuration bits stored in twelve 8-bit Configuration registers, aligned on even configuration memory address boundaries. These bits can be set or cleared to select various device configurations. There are three types of Configuration bits: system operation bits, code-protect bits and unit ID bits. The system operation bits determine the power-on settings for system level components, such as oscillator and Watchdog Timer. The code-protect bits prevent program memory from being read and written. The register descriptions for the FBS, FSS, FGS, FOSCSEL, FOSC, FWDT, FPOR and FICD Configuration registers are shown in Table 3-3. The Configuration register map is shown in Table 3-4.. Note: If any of the code-protect bits in FBS, FSS or FGS is clear, then the entire device must be erased before it can be reprogrammed.
DS70152D-page 40
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-3: dsPIC33F/PIC24H CONFIGURATION BITS DESCRIPTION
Register FBS Description Boot Segment Data RAM Code Protection 11 = No RAM is reserved for Boot Segment 10 = Small-sized Boot RAM [128 bytes of RAM are reserved for Boot Segment] 01 = Medium-sized Boot RAM [256 bytes of RAM are reserved for Boot Segment] 00 = Large-sized Boot RAM [1024 bytes of RAM are reserved for Boot Segment] [Note: This bit is Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202.] BSS<2:0> FBS Boot Segment Program Memory Code Protection 111 = No Boot Segment 110 = Standard security, Small-sized Boot Program Flash [Boot Segment ends at 0x0003FF in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. Boot Segment ends at 0x0007FF in other all other devices.] 101 = Standard security, Medium-sized Boot Program Flash [Boot Segment ends at 0x0007FF in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. Boot Segment ends at 0x001FFF in all other devices.] 100 = Standard security, Large-sized Boot Program Flash [Boot Segment ends at 0x000FFF in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. Boot Segment ends at 0x003FFF in all other devices.] 011 = No Boot Segment 010 = High security, Small-sized Boot Program Flash [Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. Boot Segment ends at 0x0007FF in all other devices.] 001 = High security, Medium-sized Boot Program Flash [Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. Boot Segment ends at 0x001FFF in all other devices.] 000 = High security, Large-sized Boot Program Flash [Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. Boot Segment ends at 0x003FFF in all other devices.] Boot Segment Program Memory Write Protection 1 = Boot Segment program memory is not write-protected 0 = Boot program memory is write-protected Bit Field RBS<1:0>
BWRP
FBS
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 41
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-3: dsPIC33F/PIC24H CONFIGURATION BITS DESCRIPTION (CONTINUED)
Register FSS Description Secure Segment Data RAM Code Protection 11 = No Data RAM is reserved for Secure Segment 10 = Small-sized Secure RAM [(256 - N) bytes of RAM are reserved for Secure Segment in all other devices.] 01 = Medium-sized Secure RAM [(2048 - N) bytes of RAM are reserved for Secure Segment in all other devices.] 00 = Large-sized Secure RAM [(4096 - N) bytes of RAM are reserved for Secure Segment in all other devices.] where N = Number of bytes of RAM reserved for Boot Sector. Note 1: This bit is Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202.] 2: If the defined Boot Segment size is greater than or equal to the defined Secure Segment, then the Secure Segment size selection has no effect and the Secure Segment is disabled. SSS<2:0> FSS Secure Segment Program Memory Code Protection 111 = No Secure Segment 110 = Standard security, Small-sized Secure Program Flash [Secure Segment ends at 0x001FFF for dsPIC33FJ64GPxxx/ dsPIC33FJ64MCxxx/PIC24HJ64GPxxx devices, and at 0x003FFF in other devices.] 101 = Standard security, Medium-sized Secure Program Flash [Secure Segment ends at 0x003FFF for dsPIC33FJ64GPxxx/ dsPIC33FJ64MCxxx/PIC24HJ64GPxxx devices, and at 0x007FFF in other devices.] 100 = Standard security, Large-sized Secure Program Flash [Secure Segment ends at 0x007FFF for dsPIC33FJ64GPxxx/ dsPIC33FJ64MCxxx/PIC24HJ64GPxxx devices, and at 0x00FFFF in other devices.] 011 = No Secure Segment 010 = High security, Small-sized Secure Program Flash [Secure Segment ends at 0x001FFF for dsPIC33FJ64GPxxx/ dsPIC33FJ64MCxxx/PIC24HJ64GPxxx devices, and at 0x003FFF in other devices.] 001 = High security, Medium-sized Secure Program Flash [Secure Segment ends at 0x003FFF for dsPIC33FJ64GPxxx/ dsPIC33FJ64MCxxx/PIC24HJ64GPxxx devices, and at 0x007FFF in other devices.] 000 = High security, Large-sized Secure Program Flash [Secure Segment ends at 0x007FFF for dsPIC33FJ64GPxxx/ dsPIC33FJ64MCxxx/PIC24HJ64GPxxx devices, and at 0x00FFFF in other devices.] [Note: This bit is Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202.] SWRP FSS Secure Segment Program Memory Write Protection 1 = Secure Segment program memory is not write-protected 0 = Secure program memory is write-protected [Note: This bit is Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202.] Bit Field RSS<1:0>
DS70152D-page 42
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-3: dsPIC33F/PIC24H CONFIGURATION BITS DESCRIPTION (CONTINUED)
Register FGS Description General Segment Code-Protect bit 11 = Code protection is disabled 10 = Standard security code protection is enabled 0x = Reserved in dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202. In all other devices, high security code protection is enabled. General Segment Write-Protect bit 1 = General Segment program memory is not write-protected 0 = General Segment program memory is write-protected Two-speed Oscillator Start-Up Enable bit 1 = Start up device with FRC, then automatically switch to the user-selected oscillator source when ready 0 = Start up device with user-selected oscillator source Temperature Protection Enable bit 1 = Temperature protection disabled 0 = Temperature protection enabled Initial Oscillator Source Selection bits 111 = Internal Fast RC (FRC) oscillator 110 = Reserved 101 = LPRC oscillator 100 = Secondary (LP) oscillator 011 = Primary (XT, HS, EC) oscillator with PLL 010 = Primary (XT, HS, EC) oscillator 001 = Internal Fast RC (FRC) oscillator with PLL 000 = Reserved Clock Switching Mode bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled Peripheral Pin Select Configuration 1 = Allow only one reconfiguration 0 = Allow multiple reconfigurations [Note: This bit is only present in the dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202 devices.] OSC2 Pin Function bit (except in XT and HS modes) 1 = OSC2 is clock output 0 = OSC2 is general purpose digital I/O pin Primary Oscillator Mode Select bits 11 = Primary oscillator disabled 10 = HS crystal oscillator mode 01 = XT crystal oscillator mode 00 = EC (external clock) mode Watchdog Enable bit 1 = Watchdog always enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register will have no effect) 0 = Watchdog enabled/disabled by user software (LPRC can be disabled by clearing the SWDTEN bit in the RCON register) Watchdog Timer Window Enable bit 1 = Watchdog Timer in Non-Window mode 0 = Watchdog Timer in Window mode Watchdog Timer Prescaler bit 1 = 1:128 0 = 1:32 Bit Field GSS<1:0>
GWRP
FGS
IESO
FOSCSEL
TEMP
FOSCSEL
FNOSC<2:0>
FOSCSEL
FCKSM<1:0>
FOSC
IOL1WAY
FOSC
OSCIOFNC
FOSC
POSCMD<1:0>
FOSC
FWDTEN
FWDT
WINDIS
FWDT
WDTPRE
FWDT
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 43
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-3: dsPIC33F/PIC24H CONFIGURATION BITS DESCRIPTION (CONTINUED)
Register FWDT Description Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 . . . 0001 = 1:2 0000 = 1:1 Motor Control PWM Module Pin mode 1 = PWM module pins controlled by PORT register at device Reset (tri-stated) 0 = PWM module pins controlled by PWM module at device Reset (configured as output pins) Motor Control PWM High-side Polarity bit 1 = PWM module high-side output pins have active-high output polarity 0 = PWM module high-side output pins have active-low output polarity Motor Control PWM Low-side Polarity bit 1 = PWM module low-side output pins have active-high output polarity 0 = PWM module low-side output pins have active-low output polarity Alternate I2CTM pins 1 = I2C mapped to SDA1/SCL1 pins 0 = I2C mapped to ASDA1/SACL1 pins [Note: This bit is only present in the dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202 devices.] Power-on Reset Timer Value Select bits 111 = PWRT = 128 ms 110 = PWRT = 64 ms 101 = PWRT = 32 ms 100 = PWRT = 16 ms 011 = PWRT = 8 ms 010 = PWRT = 4 ms 001 = PWRT = 2 ms 000 = PWRT Disabled Background Debug Enable bit 1 = Device will reset in User mode 0 = Device will reset in Debug mode Debugger/Emulator Enable bit 1 = Device will reset in Operational mode 0 = Device will reset in Clip-On Emulation mode JTAG Enable bit 1 = JTAG enabled 0 = JTAG disabled ICD Communication Channel Select bits 11 = Communicate on PGC1/EMUC1 and PGD1/EMUD1 10 = Communicate on PGC2/EMUC2 and PGD2/EMUD2 01 = Communicate on PGC3/EMUC3 and PGD3/EMUD3 00 = Reserved, do not use Unimplemented (read as `0', write as `0') Bit Field WDTPOST
PWMPIN
FPOR
HPOL
FPOR
LPOL
FPOR
ALTI2C
FPOR
FPWRT<2:0>
FPOR
BKBUG
FICD
COE
FICD
JTAGEN
FICD
ICS<1:0>
FICD
--
All
DS70152D-page 44
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 3-4:
Address 0xF80000 0xF80002 0xF80004 0xF80008 0xF8000A 0xF8000C 0xF8000E 0xF80010 0xF80012 0xF80014 0xF80016 Note 1: 2: 3:
dsPIC33F/PIC24H DEVICE CONFIGURATION REGISTER MAP
Name FBS FSS FGS IESO FWDTEN BKBUG -- WINDIS COE FOSC FWDT FPOR FICD FUID0 FUID1 FUID2 FUID3 FCKSM<1:0> PWMPIN(1) HPOL(1) Bit 7 RBS<1:0> Bit 6
(3)
Bit 5 -- -- -- TEMP IOL1WAY(2) LPOL(1) JTAGEN
Bit 4
Bit 3
Bit 2 BSS<2:0> SSS<2:0>
(3)
Bit 1
Bit 0 BWRP SWRP(3) GWRP
RSS<1:0>(3)
GSS<1:0> -- -- WDTPRE ALTI2C(2) -- -- User Unit ID Byte 0 User Unit ID Byte 1 User Unit ID Byte 2 User Unit ID Byte 3 FNOSC<2:0> OSCIOFNC
0xF80006 FOSCSEL
POSCMD<1:0>
WDTPOST<3:0> FPWRT<2:0> ICS<1:0>
On the dsPIC33F General Purpose Family devices (dsPIC33FJXXXGPXXX) and PIC24H devices, these bits are reserved (read as `1' and must be programmed as `1'). These bits are only present in the dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202 devices. In all other devices, they are unimplemented (read as `0'). In the dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 and PIC24HJ12GP201/202 devices, these bits are reserved (read as `1' and must be programmed as `1').
3.6.2
PROGRAMMING METHODOLOGY
3.6.4
Configuration bits may be programmed a single byte at a time using the PROGC command. This command specifies the configuration data and Configuration register address. When Configuration bits are programmed, any unimplemented bits must be programmed with a `0' and any reserved bits must be programmed with a `1'. Twelve PROGC commands are required to program all the Configuration bits. A flowchart for Configuration bit programming is shown in Figure 3-5. Note: If the General Code Segment CodeProtect bit (GCP) is programmed to `0', code memory is code-protected and can not be read. Code memory must be verified before enabling read protection. See Section 3.6.4 "CodeGuard Security Configuration Bits" for more information about code-protect Configuration bits.
CODEGUARD SECURITY CONFIGURATION BITS
The FBS, FSS and FGS Configuration registers are special Configuration registers that control the size and level of code protection for the Boot Segment, Secure Segment and General Segment, respectively. For each segment, two main forms of code protection are provided. One form prevents code memory from being written (write protection), while the other prevents code memory from being read (read protection). BWRP, SWRP and GWRP bits control write protection and BSS<2:0>, SSS<2:0> and GSS<1:0> bits controls read protection. The Chip Erase ERASEB command sets all the code protection bits to `1', which allows the device to be programmed. When write protection is enabled, any programming operation to code memory will fail. When read protection is enabled, any read from code memory will cause a `0x0' to be read, regardless of the actual contents of code memory. Since the programming executive always verifies what it programs, attempting to program code memory with read protection enabled will also result in failure. It is imperative that all code protection bits are `1' while the device is being programmed and verified. Only after the device is programmed and verified should any of the above bits be programmed to `0'.
3.6.3
PROGRAMMING VERIFICATION
After the Configuration bits are programmed, the contents of memory should be verified to ensure that the programming was successful. Verification requires the Configuration bits to be read back and compared against the copy held in the programmer's buffer. The READC command reads back the programmed Configuration bits and verifies that the programming was successful. Any unimplemented Configuration bits are read-only and read as `0'. The reserved bits are read-only and read as `1'.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 45
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
In addition to code memory protection, a part of Data RAM can be configured to be accessible only by code resident in the Boot Segment and/or Secure Segment. The sizes of these "reserved" sections are user-configurable, using the RBS<1:0> and RSS<1:0> bits. Note: All bits in the FBS, FSS and FGS Configuration registers can only be programmed to a value of `0'. the ERASEB command is the only way to reprogram code-protect bits from ON (`0') to OFF (`1').
3.6.5
USER UNIT ID
The dsPIC33F/PIC24H devices provide four 8-bit Configuration registers (FUID0 through FUID3) for the user to store product-specific information, such as unit serial numbers and other product manufacturing data.
FIGURE 3-5:
CONFIGURATION BIT PROGRAMMING FLOW
Start ConfigAddress = 0xF80000
Send PROGC Command
Is PROGC response PASS? Yes Is ConfigAddress 0xF80018? Yes Finish
No
ConfigAddress = ConfigAddress + 2
No
Failure Report Error
3.7
Exiting Enhanced ICSP Mode
FIGURE 3-6:
Exiting Program/Verify mode is done by removing VIH from MCLR, as shown in Figure 3-6. The only requirement for exit is that an interval P16 should elapse between the last clock and program signals on PGC and PGD before removing VIH.
EXITING ENHANCED ICSPTM MODE
P16 P17 VIH
MCLR
VDD PGD PGC VIH
PGD = Input
DS70152D-page 46
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
4.0
4.1
THE PROGRAMMING EXECUTIVE
Programming Executive Communication
The programmer and programming executive have a master-slave relationship, where the programmer is the master programming device and the programming executive is the slave. All communication is initiated by the programmer in the form of a command. Only one command at a time can be sent to the programming executive. In turn, the programming executive only sends one response to the programmer after receiving and processing a command. The programming executive command set is described in Section 4.2 "Programming Executive Commands". The response set is described in Section 4.3 "Programming Executive Responses".
After the programming executive has processed the command, it brings PGD low for 15 sec to indicate to the programmer that the response is available to be clocked out. The programmer can begin to clock out the response 23 sec after PGD is brought low and it must provide the necessary amount of clock pulses to receive the entire response from the programming executive. After the entire response is clocked out, the programmer should terminate the clock on PGC until it is time to send another command to the programming executive. This protocol is shown in Figure 4-2.
4.1.2
SPI RATE
4.1.1
COMMUNICATION INTERFACE AND PROTOCOL
In Enhanced ICSP mode, the dsPIC33F/PIC24H family devices operate from the Fast Internal RC oscillator, which has a nominal frequency of 7.3728 MHz. This oscillator frequency yields an effective system clock frequency of 1.8432 MHz. To ensure that the programmer does not clock too fast, it is recommended that a 7.35 MHz clock be provided by the programmer.
The ICSP/Enhanced ICSP interface is a 2 wire SPI implemented using the PGC and PGD pins. The PGC pin is used as a clock input pin and the clock source must be provided by the programmer. The PGD pin is used for sending command data to and receiving response data from the programming executive. All serial data is transmitted on the falling edge of PGC and latched on the rising edge of PGC. All data transmissions are sent to the Most Significant bit (MSb) first using 16-bit mode (see Figure 4-1).
4.1.3
TIME OUTS
The programming executive uses no Watchdog or time out for transmitting responses to the programmer. If the programmer does not follow the flow control mechanism using PGC as described in Section 4.1.1 "Communication Interface and Protocol", it is possible that the programming executive will behave unexpectedly while trying to send a response to the programmer. Since the programming executive has no time out, it is imperative that the programmer correctly follow the described communication protocol. As a safety measure, the programmer should use the command time outs identified in Table 4-1. If the command time out expires, the programmer should reset the programming executive and start programming the device again.
FIGURE 4-1:
PROGRAMMING EXECUTIVE SERIAL TIMING
4 5 6 11 12 13 14 15 16
P1 1 PGC P1A P1B P2 PGD MSb 14 13 12 11 ... 5 4 3 2 1 LSb P3 2 3
Since a 2 wire SPI is used, and data transmissions are bidirectional, a simple protocol is used to control the direction of PGD. When the programmer completes a command transmission, it releases the PGD line and allows the programming executive to drive this line high. The programming executive keeps the PGD line high to indicate that it is processing the command.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 47
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
FIGURE 4-2: PROGRAMMING EXECUTIVE - PROGRAMMER COMMUNICATION PROTOCOL
Host Transmits Last Command Word 1 2 15 16 Programming Executive Processes Command 1 2 Host Clocks Out Response 15 16 1 2 15 16
PGC
PGD
MSB X X X LSB P8
1 P9a
0 P9b 23 s
MSB X X X LSB 8ns
MSB X X X LSB
PGC = Input PGD = Input
PGC = Input (Idle) PGD = Output
PGC = Input PGD = Output
4.2
Programming Executive Commands
4.2.2
PACKED DATA FORMAT
The programming executive command set is shown in Table 4-1. This table contains the opcode, mnemonic, length, time out and description for each command. Functional details on each command are provided in the command descriptions (Section 4.2.4 "Command Descriptions").
When 24-bit instruction words are transferred across the 16-bit SPI interface, they are packed to conserve space using the format shown in Figure 4-4. This format minimizes traffic over the SPI and provides the programming executive with data that is properly aligned for performing table write operations.
FIGURE 4-4:
15
4.2.1
COMMAND FORMAT
PACKED INSTRUCTION WORD FORMAT
8 7 0
All programming executive commands have a general format consisting of a 16-bit header and any required data for the command (see Figure 4-3). The 16-bit header consists of a 4-bit opcode field, which is used to identify the command, followed by a 12-bit command length field.
LSW1 MSB2 LSW2 LSWx: Least Significant 16 bits of instruction word MSBx: Most Significant Byte of instruction word MSB1
FIGURE 4-3:
15 12 11
COMMAND FORMAT
0
Opcode * *
Length
Note:
Command Data First Word (if required)
When the number of instruction words transferred is odd, MSB2 is zero and LSW2 can not be transmitted.
4.2.3
Command Data Last Word (if required) The command opcode must match one of those in the command set. Any command that is received which does not match the list in Table 4-1 will return a "NACK" response (see Section 5.3.1.1 "Opcode Field"). The command length is represented in 16-bit words since the SPI operates in 16-bit mode. The programming executive uses the command length field to determine the number of words to read from the SPI port. If the value of this field is incorrect, the command will not be properly received by the programming executive.
PROGRAMMING EXECUTIVE ERROR HANDLING
The programming executive will "NACK" all unsupported commands. Additionally, due to the memory constraints of the programming executive, no checking is performed on the data contained in the programmer command. It is the responsibility of the programmer to command the programming executive with valid command arguments or the programming operation may fail. Additional information on error handling is provided in Section 5.3.1.3 "QE_Code Field".
DS70152D-page 48
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 4-1:
Opcode 0x0 0x1 0x2 0x3 0x4 0x5 0x6 0x7 0x8 0x9 0xA 0xB 0xC 0xD Note:
PROGRAMMING EXECUTIVE COMMAND SET
Length (16-bit words) 1 3 4 N/A 4 99 5 N/A N/A N/A 2 1 N/A N/A Time Out 1 msec 1 msec Sanity check. Read an 8-bit word from the specified Configuration register or Device ID register. Description
Mnemonic SCHECK READC READP RESERVED PROGC PROGP PROGW RESERVED RESERVED RESERVED QBLANK QVER RESERVED RESERVED
1 msec/row Read `N' 24-bit instruction words of code memory starting from the specified address. N/A 5 msec 5 msec 5 msec N/A N/A N/A TBD 1 msec N/A N/A This command is reserved. It will return a NACK. Write an 8-bit word to the specified Configuration register. Program one row of code memory at the specified address, then verify. Program one instruction word of code memory at the specified address, then verify. This command is reserved. It will return a NACK. This command is reserved. It will return a NACK. This command is reserved. It will return a NACK. Query if the code memory is blank. Query the programming executive software version. This command is reserved. It will return a NACK. This command is reserved. It will return a NACK.
Legend: TBD = To Be Determined One row of code memory consists of (64) 24-bit words. Refer to Table 2-2 for device-specific information.
4.2.4
COMMAND DESCRIPTIONS
All commands supported by the programming executive are described in Section 5.2.5 "SCHECK Command" through Section 4.2.12 "QVER Command".
4.2.5
15
SCHECK COMMAND
12 11 0 Length Description 0x0 0x1
Opcode Field Opcode Length
The SCHECK command instructs the programming executive to do nothing but generate a response. This command is used as a "Sanity Check" to verify that the programming executive is operational. Expected Response (2 words): 0x1000 0x0002 Note: This instruction is not required programming, but is provided development purposes only. for for
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 49
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
4.2.6
15 Opcode N Addr_LS Field Opcode Length N 0x1 0x3 Number of 8-bit Configuration registers or Device ID registers to read (max of 256) MSB of 24-bit source address Least Significant 16 bits of 24-bit source address Description Field Opcode Length N Reserved Addr_MSB Addr_LS 0x2 0x4 Number of 24-bit instructions to read (max of 32768) 0x0 MSB of 24-bit source address Least Significant 16 bits of 24-bit source address Description
READC COMMAND
12 11 87 Length Addr_MSB 0
4.2.7
15 Opcode
READP COMMAND
12 11 87 Length N Reserved Addr_LS Addr_MSB 0
Addr_MSB Addr_LS
The READC command instructs the programming executive to read N Configuration registers or Device ID registers, starting from the 24-bit address specified by Addr_MSB and Addr_LS. This command can only be used to read 8-bit or 16-bit data. When this command is used to read Configuration registers, the upper byte in every data word returned by the programming executive is 0x00 and the lower byte contains the Configuration register value. Expected Response (4 + 3 * (N - 1)/2 words for N odd): 0x1100 2+N Configuration register or Device ID Register 1 ... Configuration register or Device ID Register N Note: Reading unimplemented memory will cause the programming executive to reset. Please ensure that only memory locations present on a particular device are accessed.
The READP command instructs the programming executive to read N 24-bit words of code memory, starting from the 24-bit address specified by Addr_MSB and Addr_LS. This command can only be used to read 24bit data. All data returned in the response to this command uses the packed data format described in Section 4.2.2 "Packed Data Format". Expected Response (2 + 3 * N/2 words for N even): 0x1200 2 + 3 * N/2 Least significant program memory word 1 ... Least significant data word N Expected Response (4 + 3 * (N - 1)/2 words for N odd): 0x1200 4 + 3 * (N - 1)/2 Least significant program memory word 1 ... MSB of program memory word N (zero padded) Note: Reading unimplemented memory will cause the programming executive to reset. Please ensure that only memory locations present on a particular device are accessed.
DS70152D-page 50
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
4.2.8
15 Opcode Reserved Addr_LS Data Field Opcode Length Reserved Addr_MSB Addr_LS Data 0x4 0x4 0x0 MSB of 24-bit destination address Least Significant 16 bits of 24-bit destination address 8-bit data word Field Opcode Length Reserved Addr_MSB Addr_LS D_1 D_2 ... D_96 0x5 0x63 0x0 MSB of 24-bit destination address Least Significant 16 bits of 24-bit destination address 16-bit data word 1 16-bit data word 2 16-bit data word 3 through 95 16-bit data word 96 Description Description
PROGC COMMAND
12 11 87 Length Addr_MSB 0
4.2.9
15 Opcode
PROGP COMMAND
12 11 Reserved Addr_LS D_1 D_2 ... D_N 87 Length Addr_MSB 0
The PROGC command instructs the programming executive to program a single Configuration register, located at the specified memory address. After the specified data word has been programmed to code memory, the programming executive verifies the programmed data against the data in the command. Expected Response (2 words): 0x1400 0x0002
The PROGP command instructs the programming executive to program one row of code memory (64 instruction words) to the specified memory address. Programming begins with the row address specified in the command. The destination address should be a multiple of 0x80. The data to program to memory, located in command words D_1 through D_96, must be arranged using the packed instruction word format shown in Figure 4-4. After all data has been programmed to code memory, the programming executive verifies the programmed data against the data in the command. Expected Response (2 words): 0x1500 0x0002 Note: Refer to Table 2-2 for code memory size information.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 51
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
4.2.10
15 Opcode Reserved Addr_LS Data_LS Reserved Field Opcode Length Reserved Addr_MSB Addr_LS Data_MSB Data_LS 0x6 0x5 0x0 MSB of 24-bit destination address Least Significant 16 bits of 24-bit destination address MSB of 24-bit data Least Significant 16 bits of 24-bit data Data_MSB Description Field Opcode Length PSize 0xA 0x2 Length of program memory to check (in 24-bit words) +1, up to a max of 49152 Description
PROGW COMMAND
12 11 87 Length Addr_MSB 0
4.2.11
15 Opcode
QBLANK COMMAND
12 11 Length PSize 0
The QBLANK command queries the programming executive to determine if the contents of code memory are blank (contains all `1's). The size of code memory to check must be specified in the command. The Blank Check for code memory begins at 0x0 and advances toward larger addresses for the specified number of instruction words. QBLANK returns a QE_Code of 0xF0 if the specified code memory and code-protect bits are blank; otherwise, QBLANK returns a QE_Code of 0x0F. Expected Response (2 words for blank device): 0x1AF0 0x0002 Expected Response (2 words for non-blank device): 0x1A0F 0x0002 Note: The QBLANK command does not check the system operation Configuration bits since these bits are not set to `1' when a Chip Erase is performed.
The PROGW command instructs the programming executive to program one word of code memory (3 bytes) to the specified memory address. After the word has been programmed to code memory, the programming executive verifies the programmed data against the data in the command. Expected Response (2 words): 0x1600 0x0002
DS70152D-page 52
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
4.2.12
15 Opcode Field Opcode Length 0xB 0x1
QVER COMMAND
12 11 Length Description 0
4.3.1
RESPONSE FORMAT
All programming executive responses have a general format consisting of a two-word header and any required data for the command.
15 Opcode
12 11
87 QE_Code
0
Last_Cmd Length D_1 (if applicable) ...
The QVER command queries the version of the programming executive software stored in test memory. The "version.revision" information is returned in the response's QE_Code using a single byte with the following format: main version in upper nibble and revision in the lower nibble (i.e., 0x23 means version 2.3 of programming executive software). Expected Response (2 words): 0x1BMN (where "MN" stands for version M.N) 0x0002 Field Opcode Last_Cmd QE_Code Length D_1 D_N
D_N (if applicable)
Description Response opcode. Programmer command that generated the response. Query code or error code. Response length in 16-bit words (includes 2 header words). First 16-bit data word (if applicable). Last 16-bit data word (if applicable).
4.3
Programming Executive Responses
The programming executive sends a response to the programmer for each command that it receives. The response indicates if the command was processed correctly. It includes any required response data or error data. The programming executive response set is shown in Table 4-2. This table contains the opcode, mnemonic and description for each response. The response format is described in Section 4.3.1 "Response Format".
4.3.1.1
Opcode Field
TABLE 4-2:
Opcode 0x1 0x2 0x3
PROGRAMMING EXECUTIVE RESPONSE OPCODES
Mnemonic Description Command successfully processed. Command unsuccessfully processed. Command not known.
PASS FAIL NACK
The opcode is a 4-bit field in the first word of the response. The opcode indicates how the command was processed (see Table 4-2). If the command was processed successfully, the response opcode is PASS. If there was an error in processing the command, the response opcode is FAIL and the QE_Code indicates the reason for the failure. If the command sent to the programming executive is not identified, the programming executive returns a NACK response.
4.3.1.2
Last_Cmd Field
The Last_Cmd is a 4-bit field in the first word of the response and indicates the command that the programming executive processed. Since the programming executive can only process one command at a time, this field is technically not required. However, it can be used to verify that the programming executive correctly received the command that the programmer transmitted.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 53
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
4.3.1.3 QE_Code Field TABLE 4-4:
QE_Code 0x0 0x1 0x2 No error. Verify failed. Other error. The QE_Code is a byte in the first word of the response. This byte is used to return data for query commands and error codes for all other commands. When the programming executive processes one of the two query commands (QBLANK or QVER), the returned opcode is always PASS and the QE_Code holds the query response data. The format of the QE_Code for both queries is shown in Table 4-3.
QE_Code FOR NON-QUERY COMMANDS
Description
4.3.1.4
Response Length
TABLE 4-3:
Query QBLANK QVER
QE_Code FOR QUERIES
QE_Code
The response length indicates the length of the programming executive's response in 16-bit words. This field includes the 2 words of the response header. With the exception of the response for the READP command, the length of each response is only 2 words. The response to the READP command uses the packed instruction word format described in Section 4.2.2 "Packed Data Format". When reading an odd number of program memory words (N odd), the response to the READP command is (3 * (N + 1) / 2 + 2) words. When reading an even number of program memory words (N even), the response to the READP command is (3 * N / 2 + 2) words.
0x0F = Code memory is NOT blank 0xF0 = Code memory is blank 0xMN, where programming executive software version = M.N (i.e., 0x32 means software version 3.2).
When the programming executive processes any command other than a Query, the QE_Code represents an error code. Supported error codes are shown in Table 4-4. If a command is successfully processed, the returned QE_Code is set to 0x0, which indicates that there was no error in the command processing. If the verify of the programming for the PROGP or PROGC command fails, the QE_Code is set to 0x1. For all other programming executive errors, the QE_Code is 0x2.
DS70152D-page 54
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.0 DEVICE PROGRAMMING - ICSP
FIGURE 5-1: HIGH-LEVEL ICSPTM PROGRAMMING FLOW
Start
ICSP mode is a special programming protocol that allows you to read and write to dsPIC33F/PIC24H device family memory. The ICSP mode is the most direct method used to program the device; note, however, that Enhanced ICSP is faster. ICSP mode also has the ability to read the contents of executive memory to determine if the programming executive is present. This capability is accomplished by applying control codes and instructions serially to the device using pins PGC and PGD. In ICSP mode, the system clock is taken from the PGC pin, regardless of the device's oscillator Configuration bits. All instructions are shifted serially into an internal buffer, then loaded into the instruction register and executed. No program fetching occurs from internal memory. Instructions are fed in 24 bits at a time. PGD is used to shift data in, and PGC is used as both the serial shift clock and the CPU execution clock. Note: During ICSP operation, the operating frequency of PGC must not exceed 5 MHz.
Enter ICSPTM
Perform Bulk Erase
Program Memory
Verify Program
Program Configuration Bits
Verify Configuration Bits
Exit ICSP
5.1
Overview of the Programming Process 5.2
Done
Figure 5-1 shows the high-level overview of the programming process. After entering ICSP mode, the first action is to Bulk Erase the device. Next, the code memory is programmed, followed by the device Configuration registers. Code memory (including the Configuration registers) is then verified to ensure that programming was successful. Then, program the code-protect Configuration bits, if required.
ICSP Operation
Upon entry into ICSP mode, the CPU is Idle. Execution of the CPU is governed by an internal state machine. A 4-bit control code is clocked in using PGC and PGD and this control code is used to command the CPU (see Table 5-1). The SIX control code is used to send instructions to the CPU for execution and the REGOUT control code is used to read data out of the device via the VISI register.
TABLE 5-1:
CPU CONTROL CODES IN ICSPTM MODE
Description Shift in 24-bit instruction and execute. Shift out the VISI register. Reserved.
4-Bit Mnemonic Control Code 0000b 0001b 0010b-1111b SIX REGOUT N/A
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 55
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.2.1 SIX SERIAL INSTRUCTION EXECUTION 5.2.2 REGOUT SERIAL INSTRUCTION EXECUTION
The SIX control code allows execution of dsPIC33F/ PIC24H Programming Specification assembly instructions. When the SIX code is received, the CPU is suspended for 24 clock cycles, as the instruction is then clocked into the internal buffer. Once the instruction is shifted in, the state machine allows it to be executed over the next four clock cycles. While the received instruction is executed, the state machine simultaneously shifts in the next 4-bit command (see Figure 5-2). Note 1: Coming out of Reset, the first 4-bit control code is always forced to SIX and a forced NOP instruction is executed by the CPU. Five additional PGC clocks are needed on start-up, thereby resulting in a 9-bit SIX command instead of the normal 4-bit SIX command. After the forced SIX is clocked in, ICSP operation resumes as normal (the next 24 clock cycles load the first instruction word to the CPU). 2: TBLRDH, TBLRDL, TBLWTH and TBLWTL instructions must be followed by a NOP instruction.
The REGOUT control code allows for data to be extracted from the device in ICSP mode. It is used to clock the contents of the VISI register out of the device over the PGD pin. After the REGOUT control code is received, the CPU is held Idle for 8 cycles. After these eight cycles, an additional 16 cycles are required to clock the data out (see Figure 5-3). The REGOUT code is unique because the PGD pin is an input when the control code is transmitted to the device. However, after the control code is processed, the PGD pin becomes an output as the VISI register is shifted out. Note: Data is transmitted on the falling edge and latched on the rising edge of PGC. For all data transmissions, the Least Significant bit (LSb) is transmitted first.
FIGURE 5-2:
1 PGC P3 P2 PGD 0 0 0 0 2 3 4
SIX SERIAL EXECUTION
P1 5 6 7 8 9 P4 1 2 3 4 5 6 7 8 17 18 19 20 21 22 23 24 P4a 1 2 3 4
P1A P1B
0
0
0
0
0
LSB X
X
X
X
X
X
X
X
X
X
X
X
X
X MSB
0
0
0
0
Execute PC - 1, Fetch SIX Control Code
24-Bit Instruction Fetch Only for Program Memory Entry PGD = Input
Execute 24-Bit Instruction, Fetch Next Control Code
FIGURE 5-3:
1 PGC 2 3
REGOUT SERIAL EXECUTION
4 P4 1 2 7 8 1 2 3 4 5 6 11 12 13 14 15 16 P4a 1 2 3 4
P5
PGD
1
0
0
0
LSb
1
2
3
4
...
10 11
12 13 14 MSb
0
0
0
0
Execute Previous Instruction, CPU Held in Idle Fetch REGOUT Control Code PGD = Input
Shift Out VISI Register<15:0>
No Execution Takes Place, Fetch Next Control Code PGD = Input
PGD = Output
DS70152D-page 56
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.3 Entering ICSP Mode
The key sequence is a specific 32-bit pattern, `0100 1101 0100 0011 0100 1000 0101 0001' (more easily remembered as 0x4D434851 in hexadecimal). The device will enter Program/Verify mode only if the sequence is valid. The Most Significant bit (MSb) of the most significant nibble must be shifted in first. Once the key sequence is complete, VIH must be applied to MCLR and held at that level for as long as Program/Verify mode is to be maintained. An interval of at least time P19 and P7 must elapse before presenting data on PGD. Signals appearing on PGD before P7 has elapsed will not be interpreted as valid. On successful entry, the program memory can be accessed and programmed in serial fashion. While in ICSP mode, all unused I/Os are placed in the high-impedance state.
As shown in Figure 5-4, entering ICSP Program/Verify mode requires three steps: 1. 2. 3. MCLR is briefly driven high then low. A 32-bit key sequence is clocked into PGD. MCLR is then driven high within a specified period of time and held.
The programming voltage applied to MCLR is VIH, which is essentially VDD in the case of dsPIC33F/ PIC24H devices. There is no minimum time requirement for holding at VIH. After VIH is removed, an interval of at least P18 must elapse before presenting the key sequence on PGD.
FIGURE 5-4:
ENTERING ICSPTM MODE
P6 P14 P19 VIH VIH P7
MCLR
VDD PGD 0 b31
Program/Verify Entry Code = 0x4D434851 1 b30 0 b29 0 b28 1 b27 ... 0 b3 0 b2 0 b1 1 b0
PGC P18 P1A P1B
5.4
5.4.1
Flash Memory Programming in ICSP Mode
PROGRAMMING OPERATIONS
TABLE 5-2:
NVMCON Value 0x404F
NVMCON ERASE OPERATIONS
Erase Operation
Flash memory write and erase operations are controlled by the NVMCON register. Programming is performed by setting NVMCON to select the type of erase operation (Table 5-2) or write operation (Table 5-3) and initiating the programming by setting the WR control bit (NVMCON<15>). In ICSP mode, all programming operations are selftimed. There is an internal delay between the user setting the WR control bit and the automatic clearing of the WR control bit when the programming operation is complete. Please refer to Section TABLE 8-1: "AC/ DC Characteristics and Timing Requirements" for information about the delays associated with various programming operations.
Erase all code memory, executive memory and Configuration registers (does not erase Unit ID or Device ID registers). Erase General Segment and FGS Configuration register. Erase Secure Segment and FSS Configuration register. This operation will also erase the General Segment and FGS Configuration register. Erase a page of code memory or executive memory. Erase a Configuration register byte.
0x404D 0x404C
0x4042 0x4040
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 57
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 5-3:
NVMCON Value 0x4001 0x4000 0x4003
NVMCON WRITE OPERATIONS
Write Operation Program 1 row (64 instruction words) of code memory or executive memory. Write a Configuration register byte. Program a code memory word.
If a Segment Erase operation is required, Step 3 must be modified with the appropriate NVMCON value as per Table 5-2. The ability to individually erase various segments is a critical component of the CodeGuardTM Security features on dsPIC33F/PIC24H devices. An individual code segment may be erased without affecting other segments. In addition, the Configuration register corresponding to the erased code segment also gets erased. For example, the user might want to erase the code in the General Segment without erasing a Boot Loader located in Boot Segment. The Secure Segment Erase command is used to erase the Secure Segment and the FSS Configuration register. The General Segment Erase command is used to erase the General Segment and the FGS Configuration register. This command is only effective if a Boot Segment or Secure Segment has been enabled. Note 1: The Boot Segment and FBS Configuration register can only be erased using a Bulk Erase. 2: A Secure Segment Erase operation also erases the General Segment and FGS Configuration register. This is true even if Secure Segment is present on a device but not enabled. Before performing any segment erase operation, the programmer must first determine if the dsPIC33F/ PIC24H device has defined a Boot Segment or Secure Segment, and ensure that a segment does not get overwritten by operations on any other segment. Also, a Bulk Erase should not be performed if a Boot Segment or Secure Segment has been defined. The BSS bit field in the FBS configuration register can be read to determine whether a Boot Segment has been defined. If a Boot Segment has already been defined (and probably already been programmed), the user must be warned about this fact. Similarly, the SSS bit field in the FSS configuration register can be read to determine whether a Secure Segment has been defined. If a Secure Segment has already been defined (and probably already been programmed), the user must be warned about this fact. A Bulk Erase operation is the recommended mechanism to allow a user to overwrite the Boot Segment (if one chooses to do so). In general, the segments and CodeGuard Securityrelated configuration registers should be programmed in the following order: * FBS and Boot Segment * FSS and Secure Segment * FGS and General Segment
5.4.2
STARTING AND STOPPING A PROGRAMMING CYCLE
The WR bit (NVMCON<15>) is used to start an erase or write cycle. Setting the WR bit initiates the programming cycle. All erase and write cycles are self-timed. The WR bit should be polled to determine if the erase or write cycle has been completed. Starting a programming cycle is performed as follows: BSET NVMCON, #WR
5.5
Erasing Program Memory
The procedure for erasing program memory (all of code memory, data memory, executive memory and codeprotect bits) consists of setting NVMCON to 0x404F and then executing the programming cycle. For segment erase operations, the NVMCON value should be modified suitably, according to Table 5-2. Figure 5-5 shows the ICSP programming process for Bulk Erasing program memory. This process includes the ICSP command code, which must be transmitted (for each instruction) Least Significant bit first, using the PGC and PGD pins (see Figure 5-2). Note: Program memory must be erased before writing any data to program memory.
FIGURE 5-5:
BULK ERASE FLOW
Start
Write 0x404F to NVMCON SFR
Set the WR bit to Initiate Erase
Delay P11 + P10 Time
Done
DS70152D-page 58
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 5-4:
Command (Binary)
SERIAL INSTRUCTION EXECUTION FOR BULK ERASING CODE MEMORY
Data (Hex) Description
Step 1: Exit the Reset vector. 0000 0000 0000 0000 0000 0000 0000 0000 0000 000000 000000 040200 000000 2404FA 883B0A A8E761 000000 000000 NOP NOP GOTO NOP MOV MOV BSET NOP NOP
0x200
Step 2: Set the NVMCON to erase all program memory. #0x404F, W10 W10, NVMCON NVMCON, #WR
Step 3: Initiate the erase cycle.
Step 4: Wait for Bulk Erase operation to complete and make sure WR bit is clear. Externally time `P11' msec (see Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements") to allow sufficient time for the Bulk Erase operation to complete. MOV NVMCON, W0 MOV W0, VISI NOP Clock out contents of VISI register. Repeat until the WR bit is clear. code memory is programmed 64 instruction words at a time, Steps 4 and 5 are repeated 16 times to load all the write latches (Step 6). After the write latches are loaded, programming is initiated by writing to the NVMCON register in Steps 7 and 8. In Step 9, the internal PC is reset to 0x200. This is a precautionary measure to prevent the PC from incrementing into unimplemented memory when large devices are being programmed. Lastly, in Step 10, Steps 3-9 are repeated until all of code memory is programmed.
0000 0000 0000 0001
807600 887840 000000
5.6
Writing Code Memory
The procedure for writing code memory is similar to the procedure for writing the Configuration registers, except that 64 instruction words are programmed at a time. To facilitate this operation, working registers, W0:W5, are used as temporary holding registers for the data to be programmed. Table 5-5 shows the ICSP programming details, including the serial pattern with the ICSP command code, which must be transmitted Least Significant bit first using the PGC and PGD pins (see Figure 5-2). In Step 1, the Reset vector is exited. In Step 2, the NVMCON register is initialized for programming of code memory. In Step 3, the 24-bit starting destination address for programming is loaded into the TBLPAG register and W7 register. The upper byte of the starting destination address is stored in TBLPAG and the lower 16 bits of the destination address are stored in W7. To minimize the programming time, the same packed instruction format that the programming executive uses is utilized (Figure 4-4). In Step 4, four packed instruction words are stored in working registers, W0:W5, using the MOV instruction and the read pointer, W6, is initialized. The contents of W0:W5 holding the packed instruction word data are shown in Figure 5-6. In Step 5, eight TBLWT instructions are used to copy the data from W0:W5 to the write latches of code memory. Since
FIGURE 5-6:
PACKED INSTRUCTION WORDS IN W0:W5
8 7 0
15
W0 W1 W2 W3 W4 W5
LSW0 MSB1 LSW1 LSW2 MSB3 LSW3 MSB2 MSB0
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 59
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 5-5:
Command (Binary) 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000
SERIAL INSTRUCTION EXECUTION FOR WRITING CODE MEMORY
Data (Hex) 000000 000000 040200 000000 24001A 883B0A 200xx0 880190 2xxxx7 2xxxx0 2xxxx1 2xxxx2 2xxxx3 2xxxx4 2xxxx5 EB0300 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 NOP NOP GOTO NOP MOV MOV MOV MOV MOV MOV MOV MOV MOV MOV MOV Description
Step 1: Exit the Reset vector.
0x200
Step 2: Set the NVMCON to program 64 instruction words. #0x4001, W10 W10, NVMCON #, W0 W0, TBLPAG #, W7 #, W0 #, W1 #, W2 #, W3 #, W4 #, W5
Step 3: Initialize the write pointer (W7) for TBLWT instruction.
Step 4: Initialize the read pointer (W6) and load W0:W5 with the next 4 instruction words to program.
Step 5: Set the read pointer (W6) and load the (next set of) write latches. CLR W6 NOP TBLWTL [W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTL [W6++], NOP NOP TBLWTL [W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTL [W6++], NOP NOP
[W7]
[W7++]
[++W7]
[W7++]
[W7]
[W7++]
[++W7]
[W7++]
Step 6: Repeat steps 4-5 sixteen times to load the write latches for 64 instructions. Step 7: Initiate the write cycle. 0000 0000 0000 A8E761 000000 000000 BSET NOP NOP NVMCON, #WR
Step 8: Wait for Row Program operation to complete and make sure WR bit is clear.
DS70152D-page 60
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 5-5:
Command (Binary) -
SERIAL INSTRUCTION EXECUTION FOR WRITING CODE MEMORY (CONTINUED)
Data (Hex) Description Externally time `P13' msec (see Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements") to allow sufficient time for the Row Program operation to complete. MOV NVMCON, W0 MOV W0, VISI NOP Clock out contents of VISI register. Repeat until the WR bit is clear. GOTO NOP 0x200
0000 0000 0000 0001
807600 887840 000000
Step 9: Reset device internal PC. 0000 0000 040200 000000
Step 10: Repeat steps 3-9 until all code memory is programmed.
FIGURE 5-7:
PROGRAM CODE MEMORY FLOW
Start N=1 LoopCount = 0 Configure Device for Writes
N=N+1
Load 2 Bytes to Write Buffer at
No
All bytes written? Yes Start Write Sequence and Poll for WR bit to be cleared
N=1 LoopCount = LoopCount + 1
No
All locations done? Yes Done
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 61
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.7 Writing Configuration Memory
TABLE 5-6: DEFAULT CONFIGURATION REGISTER VALUES FOR dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/202 AND PIC24HJ12GP201/202
Name FBS FSS FGS FOSCSEL FOSC FWDT FPOR FICD FUID0 FUID1 FUID2 FUID3 Default Value 0xCF 0xFF 0x07 0xA7 0xE7 0xDF 0xF7 0xE3 0xFF 0xFF 0xFF 0xFF
The 8-bit Configuration registers are programmable, one register at a time. The default programming values recommended for the Configuration registers are shown in Table 5-6 and Table 5-7. The recommended default FOSCSEL value is 0x07, which selects the FRC clock oscillator setting. The FBS, FSS and FGS Configuration registers are special since they enable code protection for the device. For security purposes, once any bit in these registers is programmed to `0' (to enable code protection), it can only be set back to `1' by performing a Bulk Erase as described in Section 5.5 "Erasing Program Memory". Programming any of these bits from a `0' to `1' is not possible, but they may be programmed from a `1' to a `0' to enable code protection. Table 5-8 shows the ICSP programming details for clearing the Configuration registers. In Step 1, the Reset vector is exited. In Step 2, the write pointer (W7) is loaded with 0x0000, which is the original destination address (in TBLPAG, 0xF8 of program memory). In Step 3, the NVMCON is set to program one Configuration register. In Step 4, the TBLPAG register is initialized to 0xF8 for writing to the Configuration registers. In Step 5, the value to write to each Configuration register is loaded to W0. In Step 6, the Configuration register data is written to the write latch using the TBLWTL instruction. In Steps 7 and 8, the programming cycle is initiated. In Step 9, the internal PC is set to 0x200 as a safety measure to prevent the PC from incrementing into unimplemented memory. Lastly, Steps 4-9 are repeated until all twelve Configuration registers are written.
Address 0xF80000 0xF80002 0xF80004 0xF80006 0xF80008 0xF8000A 0xF8000C 0xF8000E 0xF80010 0xF80012 0xF80014 0xF80016
TABLE 5-7:
DEFAULT CONFIGURATION REGISTER VALUES FOR ALL OTHER DEVICES
Name FBS FSS FGS FOSCSEL FOSC FWDT FPOR FICD FUID0 FUID1 FUID2 FUID3 Default Value 0xCF 0xCF 0x07 0xA7 0xC7 0xDF 0xE7 0xE3 0xFF 0xFF 0xFF 0xFF
Address 0xF80000 0xF80002 0xF80004 0xF80006 0xF80008 0xF8000A 0xF8000C 0xF8000E 0xF80010 0xF80012 0xF80014 0xF80016
DS70152D-page 62
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 5-8:
Command (Binary)
SERIAL INSTRUCTION EXECUTION FOR WRITING CONFIGURATION REGISTERS
Data (Hex) Description
Step 1: Exit the Reset vector. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 000000 000000 040200 000000 200007 24000A 883B0A 200F80 880190 2xxxx0 BB1B96 000000 000000 A8E761 000000 000000 NOP NOP GOTO NOP MOV MOV MOV MOV MOV MOV
0x200
Step 2: Initialize the write pointer (W7) for the TBLWT instruction. #0x0000, W7 #0x4000, W10 W10, NVMCON #0xF8, W0 W0, TBLPAG #, W0 Step 3: Set the NVMCON register to program one Configuration register.
Step 4: Initialize the TBLPAG register.
Step 5: Load the Configuration register data to W6. Step 6: Write the Configuration register data to the write latch and increment the write pointer. TBLWTL W0, [W7++] NOP NOP BSET NOP NOP NVMCON, #WR
Step 7: Initiate the write cycle.
Step 8: Wait for the Configuration Register Write operation to complete and make sure WR bit is clear. Externally time `P20' msec (see Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements") to allow sufficient time for the Configuration Register Write operation to complete. MOV, NVMCON, W0 MOV W0, VISI NOP Clock out contents of VISI register. Repeat until the WR bit is clear. GOTO NOP 0x200
0000 0000 0000 0001
807600 887840 000000
Step 9: Reset device internal PC. 0000 0000 040200 000000
Step 10: Repeat steps 5-9 until all twelve Configuration registers are written.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 63
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.8 Reading Code Memory
To minimize the reading time, the packed instruction word format that was utilized for writing is also used for reading (see Figure 5-6). In Step 3, the write pointer, W7, is initialized. In Step 4, two instruction words are read from code memory and clocked out of the device, through the VISI register, using the REGOUT command. Step 4 is repeated until the desired amount of code memory is read.
Reading from code memory is performed by executing a series of TBLRD instructions and clocking out the data using the REGOUT command. Table 5-9 shows the ICSP programming details for reading code memory. In Step 1, the Reset vector is exited. In Step 2, the 24-bit starting source address for reading is loaded into the TBLPAG register and W6 register. The upper byte of the starting source address is stored in TBLPAG and the lower 16 bits of the source address are stored in W6.
TABLE 5-9:
Command (Binary)
SERIAL INSTRUCTION EXECUTION FOR READING CODE MEMORY
Data (Hex) Description
Step 1: Exit Reset vector. 0000 0000 0000 0000 0000 0000 0000 0000 0000 000000 000000 040200 000000 200xx0 880190 2xxxx6 207847 000000 NOP NOP GOTO NOP MOV MOV MOV MOV NOP
0x200
Step 2: Initialize TBLPAG and the read pointer (W6) for TBLRD instruction. #, W0 W0, TBLPAG #, W6 #VISI, W7
Step 3: Initialize the write pointer (W7) to point to the VISI register.
Step 4: Read and clock out the contents of the next two locations of code memory, through the VISI register, using the REGOUT command. 0000 0000 0000 0001 0000 0000 0000 0001 BA1B96 000000 000000 BA9BB6 000000 000000 TBLRDL [W6], [W7] NOP NOP Clock out contents of VISI register TBLRDH [W6++], [W7] NOP NOP Clock out contents of VISI register
Step 5: Repeat step 4 until all desired code memory is read. Step 6: Reset device internal PC. 0000 0000 040200 000000 GOTO NOP 0x200
DS70152D-page 64
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.9 Reading Configuration Memory
Table 5-10 shows the ICSP programming details for reading all of configuration memory. Note that the TBLPAG register is hard coded to 0xF8 (the upper byte address of configuration memory) and the read pointer, W6, is initialized to 0x0000.
The procedure for reading configuration memory is similar to the procedure for reading code memory, except that 16-bit data words are read (with the upper byte read being all `0's) instead of 24-bit words. Since there are twelve Configuration registers, they are read one register at a time.
TABLE 5-10:
Command (Binary)
SERIAL INSTRUCTION EXECUTION FOR READING ALL CONFIGURATION MEMORY
Data (Hex) Description
Step 1: Exit Reset vector. 0000 0000 0000 0000 0000 0000 0000 0000 0000 000000 000000 040200 000000 200F80 880190 EB0300 207847 000000 NOP NOP GOTO NOP MOV MOV CLR MOV NOP
0x200
Step 2: Initialize TBLPAG, the read pointer (W6) and the write pointer (W7) for TBLRD instruction. #0xF8, W0 W0, TBLPAG W6 #VISI, W7
Step 3: Read the Configuration register and write it to the VISI register (located at 0x784) and clock out the VISI register using the REGOUT command. 0000 0000 0000 0001 BA0BB6 000000 000000 TBLRDL [W6++], [W7] NOP NOP Clock out contents of VISI register
Step 4: Repeat step 3 twelve times to read all the Configuration registers. Step 5: Reset device internal PC. 0000 0000 040200 000000 GOTO NOP 0x200
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 65
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
5.10 Verify Code Memory and Configuration Word 5.11 Reading the Application ID Word
The verify step involves reading back the code memory space and comparing it against the copy held in the programmer's buffer. The Configuration registers are verified with the rest of the code. The verify process is shown in the flowchart in Figure 5-8. Memory reads occur a single byte at a time, so two bytes must be read to compare against the word in the programmer's buffer. Refer to Section 5.8 "Reading Code Memory" for implementation details of reading code memory. Note: Because the Configuration registers include the device code protection bit, code memory should be verified immediately after writing if code protection is enabled. This is because the device will not be readable or verifiable if a device Reset occurs after the code-protect bit in the FGS Configuration register has been cleared.
The Application ID Word is stored at address 0x8007F0 in executive code memory. To read this memory location, you must use the SIX control code to move this program memory location to the VISI register. Then, the REGOUT control code must be used to clock the contents of the VISI register out of the device. The corresponding control and instruction codes that must be serially transmitted to the device to perform this operation are shown in Table 5-11. After the programmer has clocked out the Application ID Word, it must be inspected. If the application ID has the value 0xBB, the programming executive is resident in memory and the device can be programmed using the mechanism described in Section 3.0 "Device Programming - Enhanced ICSP". However, if the application ID has any other value, the programming executive is not resident in memory; it must be loaded to memory before the device can be programmed. The procedure for loading the programming executive to memory is described in Section 6.0 "Programming the Programming Executive to Memory".
FIGURE 5-8:
VERIFY CODE MEMORY FLOW
Start
5.12
Exiting ICSP Mode
Set TBLPTR = 0
Exiting Program/Verify mode is done by removing VIH from MCLR, as shown in Figure 5-9. The only requirement for exit is that an interval P16 should elapse between the last clock and program signals on PGC and PGD before removing VIH.
FIGURE 5-9:
EXITING ICSPTM MODE
P16 P17 VIH
Read Low Byte with Post-Increment
MCLR
VDD Read High Byte with Post-Increment PGD PGC VIH
Does Word = Expect Data? Yes No All code memory verified? Yes Done
No
Failure, Report Error
PGD = Input
DS70152D-page 66
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 5-11:
Command (Binary)
SERIAL INSTRUCTION EXECUTION FOR READING THE APPLICATION ID WORD
Data (Hex) Description
Step 1: Exit Reset vector. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0001 000000 000000 040200 000000 200800 880190 205FE0 207841 000000 BA0890 000000 000000 NOP NOP GOTO NOP MOV MOV MOV MOV NOP TBLRDL NOP NOP
0x200
Step 2: Initialize TBLPAG and the read pointer (W0) for TBLRD instruction. #0x80, W0 W0, TBLPAG #0x5BE, W0 #VISI, W1 [W0], [W1]
Step 3: Output the VISI register using the REGOUT command. Clock out contents of the VISI register
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 67
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
6.0 PROGRAMMING THE PROGRAMMING EXECUTIVE TO MEMORY
Overview
Storing the programming executive to executive memory is similar to normal programming of code memory. Namely, the executive memory must first be erased, and then the programming executive must be programmed 64 words at a time. This control flow is summarized in Table 6-1.
6.1
If it is determined that the programming executive is not present in executive memory (as described in Section 3.2 "Confirming the Presence of the Programming Executive"), it must be programmed into executive memory using ICSP, as described in Section 5.0 "Device Programming - ICSP".
TABLE 6-1:
Command (Binary)
PROGRAMMING THE PROGRAMMING EXECUTIVE
Data (Hex) Description
Step 1: Exit Reset vector and erase executive memory. 0000 0000 0000 0000 0000 0000 0000 0000 0000 000000 000000 040200 000000 24072A 883B0A A8E761 000000 000000 NOP NOP GOTO NOP MOV MOV
0x200
Step 2: Initialize the NVMCON to erase a page of executive memory. #0x4042, W10 W10, NVMCON
Step 3: Initiate the erase cycle, wait for erase to complete and make sure WR bit is clear. BSET NVMCON, #15 NOP NOP Externally time `P12' msec (see Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements") to allow sufficient time for the Page Erase operation to complete. MOV NVMCON, W0 MOV W0, VISI NOP Clock out contents of VISI register. Repeat until the WR bit is clear.
0000 0000 0000 0001
807600 887840 000000
Step 4: Repeat Step 3 four times to erase all four pages of executive memory. Step 5: Initialize the NVMCON to program 64 instruction words. 0000 0000 0000 0000 0000 0000 24001A 883B0A 200800 880190 EB0380 000000 MOV MOV MOV MOV CLR NOP #0x4001, W10 W10, NVMCON #0x80, W0 W0, TBLPAG W7
Step 6: Initialize TBLPAG and the write pointer (W7).
DS70152D-page 68
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 6-1:
Command (Binary)
PROGRAMMING THE PROGRAMMING EXECUTIVE (CONTINUED)
Data (Hex) Description
Step 7: Load W0:W5 with the next 4 words of packed programming executive code and initialize W6 for programming. Programming starts from the base of executive memory (0x800000) using W6 as a read pointer and W7 as a write pointer. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 20 21 22 23 24 25 EB0300 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 MOV MOV MOV MOV MOV MOV #, W0 #, W1 #, W2 #, W3 #, W4 #, W5
Step 8: Set the read pointer (W6) and load the (next four write) latches. CLR W6 NOP TBLWTL [W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTL [W6++], NOP NOP TBLWTL [W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTH.B[W6++], NOP NOP TBLWTL [W6++], NOP NOP
[W7]
[W7++]
[++W7]
[W7++]
[W7]
[W7++]
[++W7]
[W7++]
Step 9: Repeat Steps 7-8 sixteen times to load the write latches for the 64 instructions. Step 10: Initiate the programming cycle. 0000 0000 0000 A8E761 000000 000000 BSET NOP NOP NVMCON, #15
Step 11: Wait for the Row Program operation to complete. Externally time `P13' msec (see Section TABLE 8-1: "AC/DC Characteristics and Timing Requirements") to allow sufficient time for the Page Erase operation to complete. MOV NVMCON, W0 MOV W0, VISI NOP Clock out contents of VISI register. Repeat until the WR bit is clear.
0000 0000 0000 0001
807600 887840 000000
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 69
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 6-1:
Command (Binary) 0000 0000
PROGRAMMING THE PROGRAMMING EXECUTIVE (CONTINUED)
Data (Hex) 040200 000000 GOTO NOP 0x200 Description
Step 12: Reset the device internal PC.
Step 13: Repeat Steps 7-12 until all 32 rows of executive memory have been programmed.
DS70152D-page 70
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
6.2 Programming Verification
Reading the contents of executive memory can be performed using the same technique described in Section 5.8 "Reading Code Memory". A procedure for reading executive memory is shown in Table 6-2. Note that in Step 2, the TBLPAG register is set to 0x80, such that executive memory may be read.
After the programming executive has been programmed to executive memory using ICSP, it must be verified. Verification is performed by reading out the contents of executive memory and comparing it with the image of the programming executive stored in the programmer.
TABLE 6-2:
Command (Binary)
READING EXECUTIVE MEMORY
Data (Hex) Description
Step 1: Exit the Reset vector. 0000 0000 0000 0000 0000 0000 0000 0000 000000 000000 040200 000000 200800 880190 EB0300 207847 NOP NOP GOTO NOP MOV MOV CLR MOV
0x200
Step 2: Initialize TBLPAG and the read pointer (W6) for TBLRD instruction. #0x80, W0 W0, TBLPAG W6 #VISI, W7
Step 3: Initialize the write pointer (W7) to point to the VISI register. Step 4: Read and clock out the contents of the next two locations of executive memory through the VISI register using the REGOUT command. 0000 0000 0000 0000 0001 0000 0000 0000 0001 0000 0000 000000 BA1B96 000000 000000 BA9BB6 000000 000000 040200 000000 NOP TBLRDL [W6], [W7] NOP NOP Clock out contents of VISI register TBLRDH [W6++], [W7] NOP NOP Clock out contents of VISI register GOTO NOP 0x200
Step 5: Reset the device internal PC.
Step 6: Repeat Steps 4-5 until all 2048 instruction words of executive memory are read.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 71
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
7.0 DEVICE ID
TABLE 7-1: DEVICE IDs
DEVID 0xC1 0xCD 0xCF 0xD5 0xD6 0xD7 0xD9 0xE5 0xE7 0xED 0xEE 0xEF 0xF5 0xF7 0xFF 0x89 0x8A 0x8B 0x91 0x97 0xA1 0xA3 0xA9 0xAE 0xAF 0xB7 0xBF 0x41 0x47 0x49 0x4B 0x5D 0x5F 0x65 0x67 0x61 0x63 0x71 0x73 0x7B 0x802 0x803 0x800 0x801 0x80A 0x80B DEVREV 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 0x3000 Device dsPIC33FJ64GP206 dsPIC33FJ64GP306 dsPIC33FJ64GP310 dsPIC33FJ64GP706 dsPIC33FJ64GP708 dsPIC33FJ64GP710 dsPIC33FJ128GP206 dsPIC33FJ128GP306 dsPIC33FJ128GP310 dsPIC33FJ128GP706 dsPIC33FJ128GP708 dsPIC33FJ128GP710 dsPIC33FJ256GP506 dsPIC33FJ256GP510 dsPIC33FJ256GP710 dsPIC33FJ64MC506 dsPIC33FJ64MC508 dsPIC33FJ64MC510 dsPIC33FJ64MC706 dsPIC33FJ64MC710 dsPIC33FJ128MC506 dsPIC33FJ128MC510 dsPIC33FJ128MC706 dsPIC33FJ128MC708 dsPIC33FJ128MC710 dsPIC33FJ256MC510 dsPIC33FJ256MC710 PIC24HJ64GP206 PIC24HJ64GP210 PIC24HJ64GP506 PIC24HJ64GP510 PIC24HJ128GP206 PIC24HJ128GP210 PIC24HJ128GP306 PIC24HJ128GP310 PIC24HJ128GP506 PIC24HJ128GP510 PIC24HJ256GP206 PIC24HJ256GP210 PIC24HJ256GP610 dsPIC33FJ12GP201 dsPIC33FJ12GP202 dsPIC33FJ12MC201 dsPIC33FJ12MC202 PIC24HJ12GP201 PIC24HJ12GP202
The device ID region of memory can be used to determine mask, variant and manufacturing information about the chip. The device ID region is 2 x 16-bits and it can be read using the READC command. This region of memory is read-only and can also be read when code protection is enabled. Table 7-1 shows the device ID for each device, Table 7-2 shows the Device ID registers and Table 7-3 describes the bit field of each register.
DS70152D-page 72
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 7-2:
Address 0xFF0000 0xFF0002
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION DEVICE ID REGISTERS
Bit Name 15 DEVID DEVREV PROC<3:0> 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 MASK<9:0> REV<5:0> VARIANT<5:0> DOT<5:0>
TABLE 7-3:
Bit Field MASK<9:0> VARIANT<5:0> PROC<3:0> REV<5:0> DOT<5:0>
DEVICE ID BITS DESCRIPTION
Register DEVID DEVID DEVREV DEVREV DEVREV Description Encodes the MASKSET ID of the device. Encodes the VARIANT derived from MASKSET of the device. Encodes the process of the device. Encodes the major revision number of the device. Encodes the minor revision number of the device.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 73
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
8.0 AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
Table 8-1 lists AC/DC characteristics and timing requirements.
TABLE 8-1:
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
Standard Operating Conditions Operating Temperature: -40C-85C. Programming at 25C is recommended. Param Symbol No. D111 D112 D113 D031 D041 D080 D090 D012 D013 P1 P1A P1B P2 P3 P4 P4A P5 P6 P7 P8 P9a P9b VDD IPP IDDP VIL VIH VOL VOH CIO CF TPGC TPGCL TPGCH TSET1 THLD1 TDLY1 TDLY1A TDLY2 TSET2 THLD2 TDLY3 TDLY4 TDLY5 Characteristic Supply Voltage During Programming Programming Current on MCLR Supply Current During Programming Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Capacitive Loading on I/O pin (PGD) Filter Capacitor Value on VCAP Serial Clock (PGC) Period Serial Clock (PGC) Low Time Serial Clock (PGC) High Time Input Data Setup Time to Serial Clock Input Data Hold Time from PGC Delay between 4-bit Command and Command Operand Delay between Command Operand and Next 4-bit Command Delay between Last PGC of Command to First PGC of Read of Data Word VDD Setup Time to MCLR Input Data Hold Time from MCLR Delay between Last PGC of Command Byte to PGD by Programming Executive Programming Executive Command Processing Time Delay between PGD by Programming Executive to PGD Released by Programming Executive PGC Low Time After Programming Bulk Erase Time Page Erase Time Row Programming Time MCLR Rise Time to Enter ICSP mode Data Out Valid from PGC Delay between Last PGC and MCLR MCLR to VDD Min VDDCORE -- -- VSS 0.8 VDD -- VDD - 0.7 -- 1 136 40 40 15 15 40 40 20 100 25 12 10 15 Max 3.60 5 2 0.2 VDD VDD 0.6 -- 50 10 -- -- -- -- -- -- -- -- -- -- -- -- 23 Units V A mA V V V V pF F ns ns ns ns ns ns ns ns ns ms s s s IOL = 8.5 mA @ 3.6V IOH = -3.0 mA @ 3.6V To meet AC specifications Required for controller core Conditions Normal programming(1)
P10 P11 P12 P13 P14 P15 P16 P17
TDLY6 TDLY7 TDLY8 TDLY9 TR TVALID TDLY10 THLD3
400 200 20 1.5 -- 10 0 --
-- -- -- -- 1.0 -- -- 100
ns ms ms ms s ns s ns
Note 1: VDD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be within 0.3V of VDD and VSS, respectively.
DS70152D-page 74
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
TABLE 8-1: AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED)
Standard Operating Conditions Operating Temperature: -40C-85C. Programming at 25C is recommended. Param Symbol No. P18 P19 P20 TKEY1 TKEY2 TDLY11 Characteristic Delay from First MCLR to First PGC for Key Sequence on PGD Delay from Last PGC for Key Sequence on PGD to Second MCLR Maximum Wait Time for Configuration Register Programming Min 40 25 Max -- -- 25 Units ns ns ms Conditions
Note 1: VDD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be within 0.3V of VDD and VSS, respectively.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 75
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
NOTES:
DS70152D-page 76
Preliminary
(c) 2007 Microchip Technology Inc.
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
APPENDIX A: REVISION HISTORY
Revision C (June 2006) * Added code protection Configuration register descriptions * Added information about Unit ID * Added ERASES, ERASEG and ERASEC programming executive commands * Added checksum computation equation Revision D (March 2007) * Added information specific to the dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/ 202 and PIC24HJ12GP201/202 devices in several sections, including pinout diagrams, program memory sizes and Device ID values * Added specific checksum computations for all dsPIC33F and PIC24H devices * Updated ICSP bulk/page erase and row/byte program code examples to show externally timed operation (waiting for specific delay periods) * Added the P20 timing characteristic * Updated timing characteristics and references to the timing characteristics * Updated the ICSP code examples
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 77
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
NOTES:
DS70152D-page 78
Preliminary
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
Preliminary
DS70152D-page 79
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
12/08/06
DS70152D-page 80
Preliminary
(c) 2007 Microchip Technology Inc.

▲Up To Search▲

Price & Availability of PIC24HJ256GP610

	To Download PIC24HJ256GP610 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .